SLLS154C March 1993 – February 2024 SN75ALS1177 , SN75ALS1178
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | PDIP (N) | SO (NS) | UNIT | |
---|---|---|---|---|
16 Pins | 16 Pins | |||
R θJA | Junction-to-ambient thermal resistance (see (2)) | 60.6 | 88.5 | °C/W |
R θJB | Junction-to-board thermal resistance | 48.1 | 46.2 | °C/W |
ψ JT | Junction-to-top characterization parameter | 40.6 | 50.7 | °C/W |
ψ JB | Junction-to-board characterization parameter | 27.5 | 13.5 | °C/W |
R θJC(bot) | Junction-to-case (bottom) thermal resistance | 40.3 | 50.3 | °C/W |