SLLS154C March   1993  – February 2024 SN75ALS1177 , SN75ALS1178

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Driver Section
      1. 5.4.1 Electrical Characteristics
      2. 5.4.2 Switching Characteristics
    5. 5.5 Receiver Section
      1. 5.5.1 Electrical Characteristics
      2. 5.5.2 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NS|16
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1)PDIP (N)SO (NS)UNIT
16 Pins16 Pins
R θJAJunction-to-ambient thermal resistance (see (2))60.688.5°C/W
R θJBJunction-to-board thermal resistance 48.146.2°C/W
ψ JTJunction-to-top characterization parameter 40.650.7°C/W
ψ JBJunction-to-board characterization parameter 27.513.5°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance 40.350.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.