SLLS122G July 1991 – April 2024 SN75ALS174A
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | SN75ALS174A | UNIT | |||
---|---|---|---|---|---|
N (PDIP) | DW (SOIC) | PW | |||
16 PINS | 20 PINS | 20 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 60.6 | 66.8 | 107.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 48.1 | 34.4 | 38.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 40.6 | 39.7 | 53.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 27.5 | 8.9 | 3.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 40.3 | 39 | 53.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |