SLLS694C November   2005  – July 2021 SN65C3221E , SN75C3221E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Driver Section: Electrical Characteristics
    8. 7.8  Switching Characteristics: Driver
    9. 7.9  Receiver Section: Electrical Characteristics
    10. 7.10 Switching Characteristics: Receiver
    11. 7.11 Auto-powerdown Section: Electrical Characteristics
    12. 7.12 Switching Characteristics: Auto-powerdown
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 ESD Ratings

VALUE UNIT
V (ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

DOUT, RIN

 ±15000 V

All other pins

 ±3000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.