SLLSEA9B February   2012  – August 2015 SN75DP126

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Supply Electrical Characteristics
    6. 7.6  Main Link Input Electrical Characteristics
    7. 7.7  DisplayPort Main Link Output Electrical Characteristics
    8. 7.8  HDMI/DVI Main Link Output Electrical Characteristics
    9. 7.9  HPD/CAD/EN Electrical Characteristics
    10. 7.10 AUX/DDC/I2C Electrical Characteristics
    11. 7.11 DisplayPort Main Link Output Switching Characteristics
    12. 7.12 HDMI/DVI Main Link Switching Characteristics
    13. 7.13 HPD/CAD Switching Characteristics
    14. 7.14 AUX/DDC/I2C Switching Characteristics
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Implementing the EN Signal
      2. 8.3.2 Hot Plug Detect (HPD) and Cable Adapter Detect (CAD) Description
      3. 8.3.3 OVS Function Description
      4. 8.3.4 AUX and DDC Configuration Details
      5. 8.3.5 Source-Side Main Link EQ Configuration Details
      6. 8.3.6 DP-HDMI Adaptor ID Buffer
      7. 8.3.7 GPU with a Unified AUX/DDC Configuration
      8. 8.3.8 GPU with Separate DDC and AUX Channels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes Overview
    5. 8.5 Register Maps
      1. 8.5.1 Link Training and DPCD Description
      2. 8.5.2 Local I2C Interface Overview
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 AC Coupling Capacitors
        2. 9.2.2.2 Configuration Options
        3. 9.2.2.3 Dual Layout for Single or Dual Power Supply
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Analog vs Digital vs High Power
    2. 10.2 Analog Power-Supply Pins and Analog Reference Voltages
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layer Stack
      2. 11.1.2 Power Plane Do's and Don'ts for Four-Layer Boards
      3. 11.1.3 Differential Traces
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 Trademarks

E2E is a trademark of Texas Instruments.

DisplayPort is a trademark of VESA Standards Association.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.