SLLSE57E April   2011  – March 2015 SN75DP130

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Dissipation
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Reset Signal
      2. 9.3.2 Hot Plug Detect and Cable Adapter Detect
      3. 9.3.3 AUX and DDC Configuration
      4. 9.3.4 Main Link Configuration
      5. 9.3.5 Link Training and DPCD
      6. 9.3.6 Equalization
      7. 9.3.7 Configurable Outputs
      8. 9.3.8 Squelch
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 I2C Interface Overview
    6. 9.6 Register Maps
      1. 9.6.1 SN75DP130 Local I2C Control and Status Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Logic I2C Interface
        2. 10.2.2.2 CAD Sink Over Ride
        3. 10.2.2.3 HPD Sink Over Ride
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 SN75DP130 Power Sequencing
      1. 11.1.1 Power-Up Sequence:
      2. 11.1.2 Power-Down Sequence:
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Layer Stack
      2. 12.1.2 Differential Traces
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Description (continued)

The SN75DP130 is optimized for mobile applications, and contains activity detection circuitry on the Main Link input that transitions to a low-power Output Disable mode in the absence of a valid input signal. Other low-power modes are supported, including a standby mode with typical dissipation of approximately 2 mW when no video sink (for example, monitor) is connected.

The device is characterized for an extended operational temperature range from 0°C to 85°C.

The SN75DP130 offers separate AUX and DDC source interfaces that connect to one AUX sink channel. This minimizes component count when implemented with a graphics processor (GPU) comprising separate DDC and AUX interfaces. For GPUs with combined DDC/AUX, the device can operate as a FET switch to short-circuit the AUX channel AC coupling caps while connected to a TMDS sink device. Other sideband circuits such as Hot Plug Detect (HPD) are optimized to reduce external components, providing a seamless connection to Intel, AMD, and NVIDIA graphics processors.