SLLS977F April   2009  – July 2017 SN75DP139

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (Device Power)
    6. 6.6  Electrical Characteristics (Hot Plug Detect)
    7. 6.7  Electrical Characteristics (Aux / I2C Pins)
    8. 6.8  Electrical Characteristics (TMDS and Main Link Pins)
    9. 6.9  Switching Characteristics (Hot Plug Detect)
    10. 6.10 Switching Characteristics (Aux / I2C Pins)
    11. 6.11 Switching Characteristics (TMDS and Main Link Pins)
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hot Plug Detect
      2. 7.3.2 Aux / I2C Pins
      3. 7.3.3 TMDS and Main Link Pins
      4. 7.3.4 Input/Output Equivalent Circuits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active
      2. 7.4.2 Low Power With DDC Channel Enabled
      3. 7.4.3 Low Power
    5. 7.5 Programming
      1. 7.5.1 I2C Interface Notes
      2. 7.5.2 General I2C Protocol
      3. 7.5.3 Slave Address
        1. 7.5.3.1 Sink Port Selection Register And Source Plug-In Status Register Description (Sub-Address)
        2. 7.5.3.2 Example - Reading From The SN75DP139:
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 DVI Application
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layer Stack
      2. 10.1.2 Differential Traces
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The typical application for the SN75DP139 is to translate from DP++ to TMDS, and thus expand the connectivity for any DP++ source to HDMI 1.4b and DVI sinks. This can be clearly explained when you have the SN75DP139 in a dongle connected to the DP++ source.

8.2 Typical Application

SN75DP139 typ_app_lls977.gif Figure 32. Typical Application

8.2.1 Design Requirements

DESIGN PARAMETERS VALUE
VDD Main Power Supply 3.0 - 3.6 V
Main Link Peak-to-Peak AC Input Differential Voltage 0.15 - 1.2 V
TMDS Output Termination Voltage 3.0 - 3.6 V
TMDS Output Swing Voltage Bias Resistor 3.65 - 4.02 kΩ

8.2.2 Detailed Design Procedure

8.2.2.1 DVI Application

In DVI application case, it is recommended that between the SN75DP139 TMDS outputs (OUT_Dx) and a through hole DVI connector that a series resistor placeholder is incorporated. This could help in case if there are signal integrity issues as well as help pass system level compliance.

8.2.3 Application Curve

SN75DP139 appcurve1_slls977.gif Figure 33. Data Jitter