SLLS533F May   2002  – March 2023 SN65HVD05 , SN65HVD06 , SN65HVD07 , SN75HVD05 , SN75HVD06 , SN75HVD07

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
      1.      Parameter Measurement Information
  6. 6 Function Tables
    1. 6.1 Receiver Failsafe
  7. 7 Equivalent Input and Output Schematic Diagrams
  8. 8 Application and Implementation
    1.     Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) D (SOIC)

SN65 Variation

D (SOIC) SN75 Variation

 P (PDIP) UNIT
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 116.7 175.4 125 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.3 53.6 34.9 °C/W
RθJB Junction-to-board thermal resistance 63.4 45.1 23.7 °C/W
ψJT Junction-to-top characterization parameter 8.8 10.1 12.1 °C/W
ψJB Junction-to-board characterization parameter 62.6 44.4 23.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.