SLLS533F May   2002  – March 2023 SN65HVD05 , SN65HVD06 , SN65HVD07 , SN75HVD05 , SN75HVD06 , SN75HVD07

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
      1.      Parameter Measurement Information
  6. 6 Function Tables
    1. 6.1 Receiver Failsafe
  7. 7 Equivalent Input and Output Schematic Diagrams
  8. 8 Application and Implementation
    1.     Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Package Dissipation Ratings

(See Figure 5-1 and Figure 5-2)
PACKAGE TA ≤ 25°C
POWER RATING		 DERATING FACTOR(1) ABOVE TA = 25°C TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
D(2)  710 mW  5.7 mW/°C 455 mW 369 mW
D(3)  1282 mW  10.3 mW/°C 821 mW 667 mW
P 1000 mW  8.0 m W/°C 640 mW 520 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) Tested in accordance with the Low-K thermal metric definitions of EIA/JESD51-3
(3) Tested in accordance with the High-K thermal metric definitions of EIA/JESD51-7