SLLS563I July   2003  – January 2023 SN65HVD1176 , SN75HVD1176

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Supply Current
    7. 6.7 Power Dissipation
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Receiver Failsafe
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
    3. 11.3 Related Links
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Power Dissipation

over recommended operating conditions (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYP(1)MAXUNIT
PDDevice power dissipationRL = 54 Ω, CL = 50 pF, 0 V to 3 V,
15 MHz, 50% duty cycle square wave input, driver and receiver enabled		277318mW
TAAmbient air temperatureSN65HVD1176Low-K board, no air flow,
PD = 318 mW		–4064°C
High-K board, no air flow,
PD = 318 mW		–4089°C
SN75HVD1176Low-K board, no air flow,
PD = 318 mW		0°C
High-K board, no air flow,
PD = 318 mW		0°C
TSDThermal shut down junction temperature150°C
(1) All typical values are with VCC = 5 V and TA = 25°C.