SLLS563I July   2003  – January 2023 SN65HVD1176 , SN75HVD1176

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Supply Current
    7. 6.7 Power Dissipation
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Receiver Failsafe
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
    3. 11.3 Related Links
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision H (September 2015) to Revision I (January 2023)

  • Changed the Thermal Information table Go
  • Changed the Typical Characteristics graphsGo

Changes from Revision G (June 2015) to Revision H (September 2015)

  • Changed VID ≥ 0.02 V To: VID ≥ –0.02 V in Table 7-2 Go

Changes from Revision F (June 2013) to Revision G (June 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Power Dissipation table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added storage temperature to the Absolute Maximum Ratings table Go
  • Added Psi JT and Psi JB values to the Thermal Information table Go
  • Deleted redundant IO(OFF) and IOZ lines from the Electrical Characteristics tableGo
  • Deleted redundant COD line from the Electrical Characteristics tableGo

Changes from Revision E (August 2008) to Revision F (June 2013)

  • Changed RE to RE in the pinout and Logic DiagramGo