SLLS447D October   2000  – April 2024 SN65LBC172A , SN75LBC172A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Dissipation Rating Table
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Device Functional Modes
      1. 7.1.1 Function Table
      2. 7.1.2 Equivalent Input and Output Schematic Diagrams
  9. Application and Implementation
    1. 8.1 Application Information
  10. Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
  • N|16
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

See Note (1)
MINMAXUNIT
VCCSupply voltage range−0.36V
VOOutput voltage rangeat any bus (steady state)−1015V
VOOutput voltage rangeat any bus (transient pulse through 100Ω, see Figure 6-8)−3030V
VIInput voltage rangeat any A, G, or G terminal−0.5VCC + 0.5V
TstgStorage temperature range−65150°C
PDContinuous power dissipationSee Dissipation Rating Table
TLEADLead temperature 1,6 mm (1/16 inch) from case for 10 seconds260°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.