SLLS456C November   2000  – November 2023 SN65LBC173A , SN75LBC173A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Dissipation Rating Table
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SOIC (D)PDIP (N)UNIT
16 Pins16 Pins
R θJAJunction-to-ambient thermal resistance84.660.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.548.1°C/W
R θJBJunction-to-board thermal resistance43.140.6°C/W
ψ JTJunction-to-top characterization parameter10.427.5°C/W
ψ JBJunction-to-board characterization parameter42.840.3°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.