SLLS162F July   1993  – April 2024 SN65LBC174 , SN75LBC174

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Dissipation Rating Table
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Thermal Characteristics of Ic Packages
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The SN65LBC174 and SN75LBC174 are monolithic, quadruple, differential line drivers with 3-state outputs. Both devices are designed to meet the requirements of the Electronics Industry Association Standard EIA-485. These devices are optimized for balanced multipoint bus transmission at data rates up to and exceeding 10 million bits per second. Each driver features wide positive and negative common-mode output voltage ranges, current limiting, and thermal- shutdown protection, making it suitable for party-line applications in noisy environments. Both devices are designed using LinBiCMOS™, facilitating ultralow power consumption and inherent robustness.

Both the SN65LBC174 and SN75LBC174 provide positive- and negative-current limiting and thermal shutdown for protection from line fault conditions on the transmission bus line. These devices offer optimum performance when used with the SN75LBC173 or SN75LBC175 quadruple line receivers. The SN65LBC174 and SN75LBC174 are available in the 16-terminal DIP package (N) and the 20-terminal wide-body small outline integrated circuit (SOIC) package (DW).

The SN75LBC174 is characterized for operation over the commercial temperature range of 0°C to 70°C. The SN65LBC174 is characterized over the industrial temperature range of –40°C to 85°C.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
SN65LBC174 DW 12.8mm × 10.3mm
N 19.3mm × 9.4mm
SN75LBC174 DW 12.8mm × 10.3mm
N 19.3mm × 9.4mm
(1) For more information, see Section 10.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.


GUID-2ECE22E8-33CF-42B0-8ECF-A16A396486D0-low.pngLogic Symbol(1)(2)
GUID-B608AB85-6459-4312-8915-E48D69FDEC25-low.pngLogic Diagram (Positive Logic)
†. This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2. Pin numbers shown are for the N package.