SLLS376G May   2000  – February 2023 SN65LBC176A , SN75LBC176A

PRODUCTION DATA  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9.     Typical Characteristics
      1.      Parameter Measurement Information
  6. 6Detailed Description
    1. 6.1 Device Functional Modes
      1. 6.1.1 Function Tables
      2. 6.1.2 Schematics
  7. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)All Devices in 'P' PackageSN65LBC176ADR

SN65LBC176AQDR

 OPNs Not Listed in Previous ColumnUNIT
P (PDIP) D (SOIC) D (SOIC)
8-Pins8-Pins8-Pins
R θJAJunction-to-ambient thermal resistance65.7116.7110°C/W
R θJCJunction-to-case thermal resistance54.756.344.1°C/W
R θJBJunction-to-board thermal resistance42.163.453.5°C/W
ψ JTJunction-to-top characterization parameter238.84.8°C/W
ψ JBJunction-to-board characterization parameter41.762.952.7°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.