SLLS376G May   2000  – February 2023 SN65LBC176A , SN75LBC176A

PRODUCTION DATA  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9.     Typical Characteristics
      1.      Parameter Measurement Information
  6. 6Detailed Description
    1. 6.1 Device Functional Modes
      1. 6.1.1 Function Tables
      2. 6.1.2 Schematics
  7. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Dissipation Ratings

PACKAGE TA ≤ 25°C
POWER RATING
DERATING FACTOR(1)
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
TA = 125°C
POWER RATING
D 725 mW 5.5 mW/°C 464 mW 377 mW 145 mW
P 1000 mW 8.0 mW/°C 640 mW 520 mW
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.