SLLS377E May   2000  – January 2023 SN65LBC179A , SN75LBC179A

PRODUCTION DATA  

  1. 1Features
  2. 2Description
  3. 3Revision History
  4. 4Pin Configuration and Functions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Dissipation Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Driver Electrical Characteristics
    6. 5.6 Driver Switching Characteristics
    7. 5.7 Receiver Electrical Characteristics
    8. 5.8 Receiver Switching Characteristics
    9. 5.9 Typical Characteristics
  6. 6Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Device Functional Modes
      1. 7.1.1 FUNCTION TABLE
      2. 7.1.2 Schematics
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)P (PDIP)D (SOIC)
SN65 Device		D (SOIC)
SN75 Device		UNIT
8-Pins8-Pins8-Pins
R θJAJunction-to-ambient thermal resistance65.7116.7110°C/W
R θJC(top)Junction-to-case thermal resistance54.756.344.1°C/W
R θJBJunction-to-board thermal resistance42.163.453.5°C/W
ψ JTJunction-to-top characterization parameter238.84.8°C/W
ψ JBJunction-to-board characterization parameter41.762.252.7°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.