SLLSE63A December   2010  – May 2016 SN75LVCP600

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Equalization
      2. 9.3.2 Auto Low Power (ALP) Mode
      3. 9.3.3 Out-of-Band (OOB) Support
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active
      2. 9.4.2 Squelch
      3. 9.4.3 Auto Low Power
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Return Current and Plane References
      2. 12.1.2 Split Planes - What to Avoid
      3. 12.1.3 Avoiding Crosstalk
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (December 2010) to A Revision

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Changed RX+ from I, VML to I, CML in Pin Functions tableGo
  • Changed Noninverting and inverting VML differential inputs to Noninverting and inverting CML differential inputs in the Pin Functions table DescriptionGo
  • Changed RX- from I, VML to I, CML in Pin Functions tableGo
  • Changed TX+ from I, VML to O, VML in Pin Functions tableGo
  • Changed TX- from I, VML to O, VML in Pin Functions tableGo
  • Added Parameter Measurement Information sectionGo
  • Changed RX to Rx0. in Figure 7Go