SLLSFY8 October   2024 SN75LVPE3101

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8.     14
    9. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 4-Level Control Inputs
      2. 6.3.2 Linear Equalization
      3. 6.3.3 PCIe/SATA/SATA Express Redriver Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Disconnect Mode
      3. 6.4.3 Active Mode
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical SATA, PCIe and SATA Express Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Supports PCI Express 3.0, SATA Express, and SATA Gen3
  • Ultra low-power architecture:
    • Active: < 330mW
    • Shutdown: < 700µW
  • 16 settings for up to 14dB at 4GHz of linear equalization
  • Hot-plug capable
  • Temperature range: –40°C to 85°C (industrial)
  • ESD HBM rating: ±5kV
  • Available in single 3.3V supply
  • Available in 4mm × 4mm VQFN