SBFS023C June 2003 – December 2016 SRC4190
PRODUCTION DATA.
MIN | MAX | UNIT | |
---|---|---|---|
Supply voltage, VDD | –0.3 | 4 | V |
Supply voltage, VIO | –0.3 | 4 | V |
Digital input voltage | –0.3 | 4 | V |
Operating temperature | –45 | 85 | °C |
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VDD | VDD supply voltage | 3 | 3.3 | 3.6 | V |
VIO 1.8-V supply voltage | 1.65 | 1.8 | 1.95 | V | |
VIO 3.3-V supply voltage | 3 | 3.3 | 3.6 | V | |
Operating temperature | –45 | 85 | °C |
THERMAL METRIC(1) | SRC4190 | UNIT | |
---|---|---|---|
DB (SSOP) | |||
28 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 77.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 37.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 38.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 8.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 38.1 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
DYNAMIC PERFORMANCE(1) | |||||||
Resolution | 24 | Bits | |||||
fSIN | Input sampling frequency | 4 | 212 | kHz | |||
fSOUT | Output sampling frequency | 4 | 212 | kHz | |||
Input:Output sampling ratio | Upsampling | 1:16 | |||||
Downsampling | 16:1 | ||||||
Dynamic range | BW = 20 Hz to fSOUT / 2, –60-dBFS input, fIN = 1 kHz, Unweighted (add 3 dB for A‑weighted result) |
44.1 kHz:48 kHz | 125 | dB | |||
48 kHz:44.1 kHz | 125 | ||||||
48 kHz:96 kHz | 125 | ||||||
44.1 kHz:192 kHz | 125 | ||||||
96 kHz:48 kHz | 125 | ||||||
192 kHz:12 kHz | 125 | ||||||
192 kHz:32 kHz | 125 | ||||||
192 kHz:48 kHz | 125 | ||||||
32 kHz:48 kHz | 125 | ||||||
12 kHz:192 kHz | 125 | ||||||
Total harmonic distortion + noise |
BW = 20 Hz to fSOUT / 2, 0-dBFS input, fIN = 1 kHz, Unweighted |
44.1 kHz:48 kHz | –125 | dB | |||
48 kHz:44.1 kHz | –125 | ||||||
48 kHz:96 kHz | –125 | ||||||
44.1 kHz:192 kHz | –125 | ||||||
96 kHz:48 kHz | –125 | ||||||
192 kHz:12 kHz | –125 | ||||||
192 kHz:32 kHz | –125 | ||||||
192 kHz:48 kHz | –125 | ||||||
32 kHz:48 kHz | –125 | ||||||
12 kHz:192 kHz | –125 | ||||||
Interchannel gain mismatch | 0 | dB | |||||
Interchannel phase deviation | 0 | ° | |||||
Mute attenuation | 24-bit word length, A-weighted | –128 | dB | ||||
DIGITAL INTERPOLATION FILTER | |||||||
Passband | 0.4535 × fSIN | Hz | |||||
Passband ripple | ±0.007 | dB | |||||
Transition band | 0.4535 × fSIN | 0.5465 × fSIN | Hz | ||||
Stop band | 0.5465 × fSIN | Hz | |||||
Stop band attenuation | –125 | dB | |||||
Normal group delay (LGRP = 0) | 102.53125 / fSIN | s | |||||
Low group delay (LGRP = 1) | 70.53125 / fSIN | s | |||||
DIGITAL DECIMATION FILTER | |||||||
Passband | 0.4535 × fSOUT | Hz | |||||
Passband ripple | ±0.008 | dB | |||||
Transition band | 0.4535 × fSOUT | 0.5465 × fSOUT | Hz | ||||
Stop band | 0.5465 × fSOUT | Hz | |||||
Stop band attenuation | –125 | dB | |||||
Group delay | 36.46875 / fSOUT | s | |||||
DIGITAL I/O | |||||||
VIH | High-level input voltage | 0.7 × VIO | VIO | V | |||
VIL | Low-level input voltage | 0 | 0.3 × VIO | V | |||
IIH | High-level input current | 0.5 | 10 | µA | |||
IIL | Low-level input current | 0.5 | 10 | µA | |||
VOH | High-level output voltage | IO = –4 mA | 0.8 × VIO | VIO | V | ||
VOL | Low-level output voltage | IO = 4 mA | 0 | 0.2 × VIO | V | ||
CIN | Input capacitance | 3 | pF | ||||
POWER SUPPLY | |||||||
VDD | VDD operating voltage | 3 | 3.3 | 3.6 | V | ||
VIO | VIO operating voltage | 1.65 | 3.3 | 3.6 | |||
IDD | VDD supply current | VDD = VIO = 3.3 V, RST = 0, No clocks, fSIN = 192 kHz, fSOUT = 192 kHz |
Power down | 100 | µA | ||
Dynamic | 66 | mA | |||||
IIO | VIO supply current | VDD = VIO = 3.3 V, RST = 0, No clocks, fSIN = 192 kHz, fSOUT = 192 kHz |
Power down | 100 | µA | ||
Dynamic | 2 | mA | |||||
PD | Power dissipation | VDD = VIO = 3.3 V, RST = 0, No clocks, fSIN = 192 kHz, fSOUT = 192 kHz |
Power down | 660 | µW | ||
Dynamic | 225 | mW |
PARAMETER | TEST CONDITIONS | MIN | MAX | UNIT | |
---|---|---|---|---|---|
REFERENCE CLOCK TIMING | |||||
RCKI frequency(1)(2) | 128 × fSMIN | 50 | MHz | ||
tRCKIP | RCKI period | 20 | 1 / (128 × fSMIN) | ns | |
tRCKIH | RCKI pulse width HIGH | 0.4 × tRCKIP | ns | ||
tRCKIL | RCKI pulse width LOW | 0.4 × tRCKIP | ns | ||
RESET TIMING | |||||
tRSTL | RST pulse width LOW | 500 | ns | ||
INPUT SERIAL PORT TIMING | |||||
tLRIS | LRCKI to BCKI setup time | 10 | ns | ||
tSIH | BCKI pulse width HIGH | 10 | ns | ||
tSIL | BCKI pulse width LOW | 10 | ns | ||
tLDIS | SDIN data setup time | 10 | ns | ||
tLDIH | SDIN data hold time | 10 | ns | ||
OUTPUT SERIAL PORT TIMING | |||||
tDOPD | SDOUT data delay time | 10 | ns | ||
tDOH | SDOUT data hold time | 2 | ns | ||
tSOH | BCKO pulsewidth HIGH | 10 | ns | ||
tSOL | BCKO pulse width LOW | 5 | ns | ||
TDM MODE TIMING | |||||
tLROS | LRCKO setup time | 10 | ns | ||
tLROH | LRCKO hold time | 10 | ns | ||
tTDMS | TDMI data setup time | 10 | ns | ||
tTDMH | TDMI data hold time | 10 | ns |