SBASB80 October   2024 TAA3040

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 5.14 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3 Input Channel Configurations
      4. 6.3.4 Reference Voltage
      5. 6.3.5 Programmable Microphone Bias
      6. 6.3.6 Signal-Chain Processing
        1. 6.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.6.2 Programmable Channel Gain Calibration
        3. 6.3.6.3 Programmable Channel Phase Calibration
        4. 6.3.6.4 Programmable Digital High-Pass Filter
        5. 6.3.6.5 Programmable Digital Biquad Filters
        6. 6.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 6.3.6.7 Configurable Digital Decimation Filters
          1. 6.3.6.7.1 Linear Phase Filters
            1. 6.3.6.7.1.1 Sampling Rate: 8 kHz or 7.35 kHz
            2. 6.3.6.7.1.2 Sampling Rate: 16 kHz or 14.7 kHz
            3. 6.3.6.7.1.3 Sampling Rate: 24 kHz or 22.05 kHz
            4. 6.3.6.7.1.4 Sampling Rate: 32 kHz or 29.4 kHz
            5. 6.3.6.7.1.5 Sampling Rate: 48 kHz or 44.1 kHz
            6. 6.3.6.7.1.6 Sampling Rate: 96 kHz or 88.2 kHz
            7. 6.3.6.7.1.7 Sampling Rate: 192 kHz or 176.4 kHz
            8. 6.3.6.7.1.8 Sampling Rate: 384 kHz or 352.8 kHz
            9. 6.3.6.7.1.9 Sampling Rate 768 kHz or 705.6 kHz
          2. 6.3.6.7.2 Low-Latency Filters
            1. 6.3.6.7.2.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 6.3.6.7.2.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 6.3.6.7.2.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 6.3.6.7.2.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 6.3.6.7.2.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 6.3.6.7.2.6 Sampling Rate 192 kHz or 176.4 kHz
          3. 6.3.6.7.3 Ultra-Low-Latency Filters
            1. 6.3.6.7.3.1 Sampling Rate: 16 kHz or 14.7 kHz
            2. 6.3.6.7.3.2 Sampling Rate: 24 kHz or 22.05 kHz
            3. 6.3.6.7.3.3 Sampling Rate: 32 kHz or 29.4 kHz
            4. 6.3.6.7.3.4 Sampling Rate: 48 kHz or 44.1 kHz
            5. 6.3.6.7.3.5 Sampling Rate: 96 kHz or 88.2 kHz
            6. 6.3.6.7.3.6 Sampling Rate 192 kHz or 176.4 kHz
            7. 6.3.6.7.3.7 Sampling Rate 384 kHz or 352.8 kHz
      7. 6.3.7 Automatic Gain Controller (AGC)
      8. 6.3.8 Digital PDM Microphone Record Channel
      9. 6.3.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 6.4 Device Functional Modes
      1. 6.4.1 Hardware Shutdown
      2. 6.4.2 Sleep Mode or Software Shutdown
      3. 6.4.3 Active Mode
      4. 6.4.4 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 Register Descriptions
        1. 7.1.1.1  PAGE_CFG Register (page = 0x00, address = 0x00) [reset = 0h]
        2. 7.1.1.2  SW_RESET Register (page = 0x00, address = 0x01) [reset = 0h]
        3. 7.1.1.3  SLEEP_CFG Register (page = 0x00, address = 0x02) [reset = 0h]
        4. 7.1.1.4  SHDN_CFG Register (page = 0x00, address = 0x05) [reset = 5h]
        5. 7.1.1.5  ASI_CFG0 Register (page = 0x00, address = 0x07) [reset = 30h]
        6. 7.1.1.6  ASI_CFG1 Register (page = 0x00, address = 0x08) [reset = 0h]
        7. 7.1.1.7  ASI_CFG2 Register (page = 0x00, address = 0x09) [reset = 0h]
        8. 7.1.1.8  ASI_CH1 Register (page = 0x00, address = 0x0B) [reset = 0h]
        9. 7.1.1.9  ASI_CH2 Register (page = 0x00, address = 0x0C) [reset = 1h]
        10. 7.1.1.10 ASI_CH3 Register (page = 0x00, address = 0x0D) [reset = 2h]
        11. 7.1.1.11 ASI_CH4 Register (page = 0x00, address = 0x0E) [reset = 3h]
        12. 7.1.1.12 ASI_CH5 Register (page = 0x00, address = 0x0F) [reset = 4h]
        13. 7.1.1.13 ASI_CH6 Register (page = 0x00, address = 0x10) [reset = 5h]
        14. 7.1.1.14 ASI_CH7 Register (page = 0x00, address = 0x11) [reset = 6h]
        15. 7.1.1.15 ASI_CH8 Register (page = 0x00, address = 0x12) [reset = 7h]
        16. 7.1.1.16 MST_CFG0 Register (page = 0x00, address = 0x13) [reset = 2h]
        17. 7.1.1.17 MST_CFG1 Register (page = 0x00, address = 0x14) [reset = 48h]
        18. 7.1.1.18 ASI_STS Register (page = 0x00, address = 0x15) [reset = FFh]
        19. 7.1.1.19 CLK_SRC Register (page = 0x00, address = 0x16) [reset = 10h]
        20. 7.1.1.20 PDMCLK_CFG Register (page = 0x00, address = 0x1F) [reset = 40h]
        21. 7.1.1.21 PDMIN_CFG Register (page = 0x00, address = 0x20) [reset = 0h]
        22. 7.1.1.22 GPIO_CFG0 Register (page = 0x00, address = 0x21) [reset = 22h]
        23. 7.1.1.23 GPO_CFG0 Register (page = 0x00, address = 0x22) [reset = 0h]
        24. 7.1.1.24 GPO_CFG1 Register (page = 0x00, address = 0x23) [reset = 0h]
        25. 7.1.1.25 GPO_CFG2 Register (page = 0x00, address = 0x24) [reset = 0h]
        26. 7.1.1.26 GPO_CFG3 Register (page = 0x00, address = 0x25) [reset = 0h]
        27. 7.1.1.27 GPO_VAL Register (page = 0x00, address = 0x29) [reset = 0h]
        28. 7.1.1.28 GPIO_MON Register (page = 0x00, address = 0x2A) [reset = 0h]
        29. 7.1.1.29 GPI_CFG0 Register (page = 0x00, address = 0x2B) [reset = 0h]
        30. 7.1.1.30 GPI_CFG1 Register (page = 0x00, address = 0x2C) [reset = 0h]
        31. 7.1.1.31 GPI_MON Register (page = 0x00, address = 0x2F) [reset = 0h]
        32. 7.1.1.32 INT_CFG Register (page = 0x00, address = 0x32) [reset = 0h]
        33. 7.1.1.33 INT_MASK0 Register (page = 0x00, address = 0x33) [reset = FFh]
        34. 7.1.1.34 INT_LTCH0 Register (page = 0x00, address = 0x36) [reset = 0h]
        35. 7.1.1.35 BIAS_CFG Register (page = 0x00, address = 0x3B) [reset = 0h]
        36. 7.1.1.36 CH1_CFG0 Register (page = 0x00, address = 0x3C) [reset = 0h]
        37. 7.1.1.37 CH1_CFG1 Register (page = 0x00, address = 0x3D) [reset = 0h]
        38. 7.1.1.38 CH1_CFG2 Register (page = 0x00, address = 0x3E) [reset = C9h]
        39. 7.1.1.39 CH1_CFG3 Register (page = 0x00, address = 0x3F) [reset = 80h]
        40. 7.1.1.40 CH1_CFG4 Register (page = 0x00, address = 0x40) [reset = 0h]
        41. 7.1.1.41 CH2_CFG0 Register (page = 0x00, address = 0x41) [reset = 0h]
        42. 7.1.1.42 CH2_CFG1 Register (page = 0x00, address = 0x42) [reset = 0h]
        43. 7.1.1.43 CH2_CFG2 Register (page = 0x00, address = 0x43) [reset = C9h]
        44. 7.1.1.44 CH2_CFG3 Register (page = 0x00, address = 0x44) [reset = 80h]
        45. 7.1.1.45 CH2_CFG4 Register (page = 0x00, address = 0x45) [reset = 0h]
        46. 7.1.1.46 CH3_CFG0 Register (page = 0x00, address = 0x46) [reset = 0h]
        47. 7.1.1.47 CH3_CFG1 Register (page = 0x00, address = 0x47) [reset = 0h]
        48. 7.1.1.48 CH3_CFG2 Register (page = 0x00, address = 0x48) [reset = C9h]
        49. 7.1.1.49 CH3_CFG3 Register (page = 0x00, address = 0x49) [reset = 80h]
        50. 7.1.1.50 CH3_CFG4 Register (page = 0x00, address = 0x4A) [reset = 0h]
        51. 7.1.1.51 CH4_CFG0 Register (page = 0x00, address = 0x4B) [reset = 0h]
        52. 7.1.1.52 CH4_CFG1 Register (page = 0x00, address = 0x4C) [reset = 0h]
        53. 7.1.1.53 CH4_CFG2 Register (page = 0x00, address = 0x4D) [reset = C9h]
        54. 7.1.1.54 CH4_CFG3 Register (page = 0x00, address = 0x4E) [reset = 80h]
        55. 7.1.1.55 CH4_CFG4 Register (page = 0x00, address = 0x4F) [reset = 0h]
        56. 7.1.1.56 CH5_CFG2 Register (page = 0x00, address = 0x52) [reset = C9h]
        57. 7.1.1.57 CH5_CFG3 Register (page = 0x00, address = 0x53) [reset = 80h]
        58. 7.1.1.58 CH5_CFG4 Register (page = 0x00, address = 0x54) [reset = 0h]
        59. 7.1.1.59 CH6_CFG2 Register (page = 0x00, address = 0x57) [reset = C9h]
        60. 7.1.1.60 CH6_CFG3 Register (page = 0x00, address = 0x58) [reset = 80h]
        61. 7.1.1.61 CH6_CFG4 Register (page = 0x00, address = 0x59) [reset = 0h]
        62. 7.1.1.62 CH7_CFG2 Register (page = 0x00, address = 0x5C) [reset = C9h]
        63. 7.1.1.63 CH7_CFG3 Register (page = 0x00, address = 0x5D) [reset = 80h]
        64. 7.1.1.64 CH7_CFG4 Register (page = 0x00, address = 0x5E) [reset = 0h]
        65. 7.1.1.65 CH8_CFG2 Register (page = 0x00, address = 0x61) [reset = C9h]
        66. 7.1.1.66 CH8_CFG3 Register (page = 0x00, address = 0x62) [reset = 80h]
        67. 7.1.1.67 CH8_CFG4 Register (page = 0x00, address = 0x63) [reset = 0h]
        68. 7.1.1.68 DSP_CFG0 Register (page = 0x00, address = 0x6B) [reset = 1h]
        69. 7.1.1.69 DSP_CFG1 Register (page = 0x00, address = 0x6C) [reset = 40h]
        70. 7.1.1.70 AGC_CFG0 Register (page = 0x00, address = 0x70) [reset = E7h]
        71. 7.1.1.71 IN_CH_EN Register (page = 0x00, address = 0x73) [reset = F0h]
        72. 7.1.1.72 ASI_OUT_CH_EN Register (page = 0x00, address = 0x74) [reset = 0h]
        73. 7.1.1.73 PWR_CFG Register (page = 0x00, address = 0x75) [reset = 0h]
        74. 7.1.1.74 DEV_STS0 Register (page = 0x00, address = 0x76) [reset = 0h]
        75. 7.1.1.75 DEV_STS1 Register (page = 0x00, address = 0x77) [reset = 80h]
        76. 7.1.1.76 I2C_CKSUM Register (page = 0x00, address = 0x7E) [reset = 0h]
    2. 7.2 Programmable Coefficient Registers
      1. 7.2.1 Programmable Coefficient Registers: Page = 0x02
      2. 7.2.2 Programmable Coefficient Registers: Page = 0x03
      3. 7.2.3 Programmable Coefficient Registers: Page = 0x04
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Four-Channel Analog Microphone Recording
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Example Device Register Configuration Script for EVM Setup
      2. 8.2.2 Eight-Channel Digital PDM Microphone Recording
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 8.3 What to Do and What Not to Do
      1. 8.3.1 182
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
      1. 11.1.1 Packaging Information
      2. 11.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1.1 Packaging Information

Orderable DeviceStatus (1)Package TypePackage DrawingPinsPackage QtyEco Plan (2)Lead/Ball Finish(4)MSL Peak Temp (3)Op Temp (°C)Device Marking(5)(6)

TAA3040RTWR

PRE_PRODWQFNRTW243000Green (RoHS & no Sb/Br)CU NIPDAULevel-2-260C-1 YEAR-40 to 105AD3140
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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