SLASF30A January   2022  – December 2024 TAA5212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digital Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 ADC Signal-Chain
          1. 6.3.6.1.1  6 to 4 Input Select Multiplexer (6:4 MUX)
          2. 6.3.6.1.2  Programmable Channel Gain and Digital Volume Control
          3. 6.3.6.1.3  Programmable Channel Gain Calibration
          4. 6.3.6.1.4  Programmable Channel Phase Calibration
          5. 6.3.6.1.5  Programmable Digital High-Pass Filter
          6. 6.3.6.1.6  Programmable Digital Biquad Filters
          7. 6.3.6.1.7  Programmable Channel Summer and Digital Mixer
          8. 6.3.6.1.8  Configurable Digital Decimation Filters
            1. 6.3.6.1.8.1 Linear-phase filters
              1. 6.3.6.1.8.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.6.1.8.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.6.1.8.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.6.1.8.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.6.1.8.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.6.1.8.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.6.1.8.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.6.1.8.2 Low-latency Filters
              1. 6.3.6.1.8.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.6.1.8.3 Ultra Low-latency Filters
              1. 6.3.6.1.8.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.3.5 Sampling Rate: 192kHz or 176.4kHz
          9. 6.3.6.1.9  Automatic Gain Controller (AGC)
          10. 6.3.6.1.10 Voice Activity Detection (VAD)
          11. 6.3.6.1.11 Ultrasonic Activity Detection (UAD)
      7. 6.3.7  Digital PDM Microphone Record Channel
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Power Tune Mode
      10. 6.3.10 Incremental ADC (IADC) Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAA5212_B0_P0 Registers
      2. 7.1.2 TAA5212_B0_P1 Registers
      3. 7.1.3 TAA5212_B0_P3 Registers
    2. 7.2 Programmable Coefficienct Registers
      1. 7.2.1 Programmable Coefficient Registers: Page 8
      2. 7.2.2 Programmable Coefficient Registers: Page 9
      3. 7.2.3 Programmable Coefficient Registers: Page 10
      4. 7.2.4 Programmable Coefficient Registers: Page 11
      5. 7.2.5 Programmable Coefficient Registers: Page 19
      6. 7.2.6 Programmable Coefficient Registers: Page 27
      7. 7.2.7 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 AVDD_MODE for 1.8V Operation
      2. 8.3.2 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.4 Reference Voltage

All audio data converters require a DC reference voltage. The TAA5212 achieves low-noise performance by internally generating a low-noise reference voltage. This reference voltage is generated using a band-gap circuit with high PSRR performance. This audio converter reference voltage must be filtered externally using a minimum 1µF capacitor connected from the VREF pin to device ground (VSS).

The value of this reference voltage can be configured using the VREF_FSCALE (P0_R77_D[1:0]) register bits and must be set to an appropriate value based on the desired full-scale input for the device and the AVDD supply voltage available in the system. The default VREF value is set to 2.75V, which in turn supports a 2VRMS differential full-scale input to the device. The required minimum AVDD voltage for this mode is 3V. The TAA5212 also supports high swing mode with 4VRMS differential swing which can be enabled by setting ADC_CHx_FULLSCALE_VAL (P0_R80_D[1] and P0_R85_D[1]) to 1'b1 for each channel independently. Table 6-12 lists the various VREF settings supported along with required AVDD operation mode and the supported full-scale input signal for that configuration.

Table 6-12 VREF Programmable Settings
P0_R77_D[1:0] : VREF_FSCALE[1:0] VREF OUTPUT VOLTAGE DIFFERENTIAL FULL-SCALE INPUT SUPPORTED SINGLE-ENDED FULL-SCALE INPUT SUPPORTED AVDD OPERATION MODE
00 (default) 2.75V 2VRMS (4VRMS supported in high swing mode) 1VRMS (2VRMS supported in high swing mode) AVDD 3.3V Operation
01 2.5V 1.818VRMS 0.909VRMS AVDD 3.3V Operation
10 1.375V 1VRMS 0.5VRMS AVDD 1.8V Operation
11 Reserved Reserved Reserved Reserved

To achieve low-power consumption, this audio reference block is powered down during the sleep or software shutdown modes as described in Section 6.4.1. When exiting sleep mode, the audio reference block is powered up using the internal fast-charge scheme and the VREF pin settles to its steady-state voltage after the settling time (which is a function of the decoupling capacitor on the VREF pin). This time is approximately equal to 3.5ms when using a 1μF decoupling capacitor. If a higher-value decoupling capacitor is used on the VREF pin, the fast-charge setting must be reconfigured using the VREF_QCHG (P0_R2_D[5:4]) register bits, which support options of 3.5ms (default), 10ms, 50ms, or 100ms.