SLASF30A January   2022  – December 2024 TAA5212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digital Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 ADC Signal-Chain
          1. 6.3.6.1.1  6 to 4 Input Select Multiplexer (6:4 MUX)
          2. 6.3.6.1.2  Programmable Channel Gain and Digital Volume Control
          3. 6.3.6.1.3  Programmable Channel Gain Calibration
          4. 6.3.6.1.4  Programmable Channel Phase Calibration
          5. 6.3.6.1.5  Programmable Digital High-Pass Filter
          6. 6.3.6.1.6  Programmable Digital Biquad Filters
          7. 6.3.6.1.7  Programmable Channel Summer and Digital Mixer
          8. 6.3.6.1.8  Configurable Digital Decimation Filters
            1. 6.3.6.1.8.1 Linear-phase filters
              1. 6.3.6.1.8.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.6.1.8.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.6.1.8.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.6.1.8.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.6.1.8.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.6.1.8.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.6.1.8.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.6.1.8.2 Low-latency Filters
              1. 6.3.6.1.8.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.6.1.8.3 Ultra Low-latency Filters
              1. 6.3.6.1.8.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.3.5 Sampling Rate: 192kHz or 176.4kHz
          9. 6.3.6.1.9  Automatic Gain Controller (AGC)
          10. 6.3.6.1.10 Voice Activity Detection (VAD)
          11. 6.3.6.1.11 Ultrasonic Activity Detection (UAD)
      7. 6.3.7  Digital PDM Microphone Record Channel
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Power Tune Mode
      10. 6.3.10 Incremental ADC (IADC) Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAA5212_B0_P0 Registers
      2. 7.1.2 TAA5212_B0_P1 Registers
      3. 7.1.3 TAA5212_B0_P3 Registers
    2. 7.2 Programmable Coefficienct Registers
      1. 7.2.1 Programmable Coefficient Registers: Page 8
      2. 7.2.2 Programmable Coefficient Registers: Page 9
      3. 7.2.3 Programmable Coefficient Registers: Page 10
      4. 7.2.4 Programmable Coefficient Registers: Page 11
      5. 7.2.5 Programmable Coefficient Registers: Page 19
      6. 7.2.6 Programmable Coefficient Registers: Page 27
      7. 7.2.7 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 AVDD_MODE for 1.8V Operation
      2. 8.3.2 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing

Certain events in the device may require host processor intervention and can be used to trigger interrupts to the host processor. One such event is an audio serial interface (ASI) bus error. The device powers down the record channels if any faults are detected with the ASI bus error clocks, such as:

  • Invalid FSYNC frequency
  • Invalid SBCLK to FSYNC ratio
  • Long pauses of the SBCLK or FSYNC clocks

When an ASI bus clock error is detected, the device shuts down all the record and playback channels as quickly as possible. After all ASI bus clock errors are resolved, the device volume ramps back to its previous state to recover the audio. During an ASI bus clock error, the internal interrupt request (IRQ) interrupt signal asserts low if the clock error interrupt mask register bit INT_MASK0[7] (P1_R47_D[7]) is set low. The clock fault is also available for readback in the latched fault status register bit INT_LTCH0 (P1_R52), which is a read-only register. Reading the latched fault status register, INT_LTCH0, clears all latched fault status. The device can be additionally configured to route the internal IRQ interrupt signal on the GPIOx or GPO1 pins and also can be configured as open-drain outputs so that these pins can be wire-ANDed to the open-drain interrupt outputs of other devices.

The IRQ interrupt signal can either be configured as active low or active high polarity by setting the INT_POL (P0_R66_D[7]) register bit. This signal can also be configured as a single pulse or a series of pulses by programming the INT_EVENT[1:0] (P0_R66_D[6:5]) register bits. If the interrupts are configured as a series of pulses, the events trigger the start of pulses that stop when the latched fault status register is read to determine the cause of the interrupt.

The device also supports read-only live-status registers to determine if the channels are powered up or down and if the device is in sleep mode or not. These status registers are located in the DEV_STS0 (P0_R121) and DEV_STS1 (P0_R122) register bits.

The device has a multifunctional GPIOx, GPI1 and GPO1 pins that can be configured for a desired specific function. Table 6-41 lists all possible allocations of these multifunctional pins for the various features.

Table 6-41 Multifunction Pin Assignments
ROW PIN FUNCTION GPIO1 GPIO2 GPO1 GPI1
— — GPIO1_CFG GPIO2_CFG GPO1_CFG GPI1_CFG
— — P0_R10[7:4] P0_R11[7:4] P0_R12[7:4] P0_R13[1]
A Pin disabled S(1) S (default) S (default) S (default)
B General-purpose output (GPO) S S S NS
C Interrupt output (IRQ) S (default) S S NS
D Power down for all ADC channels S S NS S
E PDM clock output (PDMCLK) S S S NS
F MiCBIAS on/off input (BIASEN) S S NS S
G General-purpose input (GPI) S S NS S
H Controller clock input (CCLK) S S S S
I ASI daisy-chain input S S NS S
J PDM data input 1 (PDMDIN1) S S NS S
K PDM data input 2 (PDMDIN2) S S NS S
L ASI DOUT S S S NS
M ASI BCLK S S S S
N ASI FSYNC S S S S
O General Purpose Clock Out S S S NS
P Incremental ADC Conversion Start S S NS S
(1) S means the feature mentioned in this row is supported for the respective GPIO1, GPOx, or GPIx pin mentioned in this column.

Each GPO1 or GPIOx pin can be independently set for the desired drive configurations setting using the GPIOx_DRV[2:0] or GPO1_DRV[2:0] register bits in P0_R10_D[2:0], P0_R11_D[2:0] and P0_R12_D[2:0] respectively. Table 6-42 lists the drive configuration settings.

Table 6-42 GPIOx or GPO1 Pins Drive Configuration Settings
P0_R10_D[2:0] : GPIO1_DRV[2:0] GPIO OUTPUT DRIVE CONFIGURATION SETTINGS FOR GPIO1
000 The GPIO1 pin is set to high impedance (floated)
001 The GPIO1 pin is set to be driven active low or active high
010 (default) The GPIO1 pin is set to be driven active low or weak high (on-chip pullup)
011 The GPIO1 pin is set to be driven active low or Hi-Z (floated)
100 The GPIO1 pin is set to be driven weak low (on-chip pulldown) or active high
101 The GPIO1 pin is set to be driven Hi-Z (floated) or active high
110 and 111 Reserved (do not use these settings)

When configured as a general-purpose output (GPO), the GPIOx or GPO1 pin values can be driven by writing the GPO_GPI_VAL (P0_R14) registers. The GPIO_MON bits (P0_R14_D[3:1]) can be used to readback the status of the GPIOx or GPI1 pin when configured as a general-purpose input (GPI).