SLASF30A January   2022  – December 2024 TAA5212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digital Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 ADC Signal-Chain
          1. 6.3.6.1.1  6 to 4 Input Select Multiplexer (6:4 MUX)
          2. 6.3.6.1.2  Programmable Channel Gain and Digital Volume Control
          3. 6.3.6.1.3  Programmable Channel Gain Calibration
          4. 6.3.6.1.4  Programmable Channel Phase Calibration
          5. 6.3.6.1.5  Programmable Digital High-Pass Filter
          6. 6.3.6.1.6  Programmable Digital Biquad Filters
          7. 6.3.6.1.7  Programmable Channel Summer and Digital Mixer
          8. 6.3.6.1.8  Configurable Digital Decimation Filters
            1. 6.3.6.1.8.1 Linear-phase filters
              1. 6.3.6.1.8.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.6.1.8.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.6.1.8.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.6.1.8.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.6.1.8.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.6.1.8.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.6.1.8.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.6.1.8.2 Low-latency Filters
              1. 6.3.6.1.8.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.6.1.8.3 Ultra Low-latency Filters
              1. 6.3.6.1.8.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.3.5 Sampling Rate: 192kHz or 176.4kHz
          9. 6.3.6.1.9  Automatic Gain Controller (AGC)
          10. 6.3.6.1.10 Voice Activity Detection (VAD)
          11. 6.3.6.1.11 Ultrasonic Activity Detection (UAD)
      7. 6.3.7  Digital PDM Microphone Record Channel
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Power Tune Mode
      10. 6.3.10 Incremental ADC (IADC) Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAA5212_B0_P0 Registers
      2. 7.1.2 TAA5212_B0_P1 Registers
      3. 7.1.3 TAA5212_B0_P3 Registers
    2. 7.2 Programmable Coefficienct Registers
      1. 7.2.1 Programmable Coefficient Registers: Page 8
      2. 7.2.2 Programmable Coefficient Registers: Page 9
      3. 7.2.3 Programmable Coefficient Registers: Page 10
      4. 7.2.4 Programmable Coefficient Registers: Page 11
      5. 7.2.5 Programmable Coefficient Registers: Page 19
      6. 7.2.6 Programmable Coefficient Registers: Page 27
      7. 7.2.7 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 AVDD_MODE for 1.8V Operation
      2. 8.3.2 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.5.1.1.2.3 I2C Single-Byte Read

As shown in Figure 6-66, a single-byte data read transfer begins with the controller device transmitting a start condition followed by the I2C target address and the read/write bit. For the data read transfer, both a write followed by a read are done. Initially, a write is done to transfer the address byte of the internal register address to be read. As a result, the read/write bit is set to 0.

After receiving the target address and the read/write bit, the device responds with an acknowledge bit (ACK). The controller device then sends the internal register address byte, after which the device issues an acknowledge bit (ACK). The controller device transmits another start condition followed by the target address and the read/write bit again. This time, the read/write bit is set to 1, indicating a read transfer. Next, the device transmits the data byte from the register address being read. After receiving the data byte, the controller device transmits a not-acknowledge (NACK) followed by a stop condition to complete the single-byte data read transfer.

TAA5212 I2C Single-Byte Read Transfer Figure 6-68 I2C Single-Byte Read Transfer