SLASF30A January   2022  – December 2024 TAA5212

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digital Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 ADC Signal-Chain
          1. 6.3.6.1.1  6 to 4 Input Select Multiplexer (6:4 MUX)
          2. 6.3.6.1.2  Programmable Channel Gain and Digital Volume Control
          3. 6.3.6.1.3  Programmable Channel Gain Calibration
          4. 6.3.6.1.4  Programmable Channel Phase Calibration
          5. 6.3.6.1.5  Programmable Digital High-Pass Filter
          6. 6.3.6.1.6  Programmable Digital Biquad Filters
          7. 6.3.6.1.7  Programmable Channel Summer and Digital Mixer
          8. 6.3.6.1.8  Configurable Digital Decimation Filters
            1. 6.3.6.1.8.1 Linear-phase filters
              1. 6.3.6.1.8.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.6.1.8.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.6.1.8.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.6.1.8.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.6.1.8.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.6.1.8.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.6.1.8.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.6.1.8.2 Low-latency Filters
              1. 6.3.6.1.8.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.6.1.8.3 Ultra Low-latency Filters
              1. 6.3.6.1.8.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.3.5 Sampling Rate: 192kHz or 176.4kHz
          9. 6.3.6.1.9  Automatic Gain Controller (AGC)
          10. 6.3.6.1.10 Voice Activity Detection (VAD)
          11. 6.3.6.1.11 Ultrasonic Activity Detection (UAD)
      7. 6.3.7  Digital PDM Microphone Record Channel
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Power Tune Mode
      10. 6.3.10 Incremental ADC (IADC) Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAA5212_B0_P0 Registers
      2. 7.1.2 TAA5212_B0_P1 Registers
      3. 7.1.3 TAA5212_B0_P3 Registers
    2. 7.2 Programmable Coefficienct Registers
      1. 7.2.1 Programmable Coefficient Registers: Page 8
      2. 7.2.2 Programmable Coefficient Registers: Page 9
      3. 7.2.3 Programmable Coefficient Registers: Page 10
      4. 7.2.4 Programmable Coefficient Registers: Page 11
      5. 7.2.5 Programmable Coefficient Registers: Page 19
      6. 7.2.6 Programmable Coefficient Registers: Page 27
      7. 7.2.7 Programmable Coefficient Registers: Page 28
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 AVDD_MODE for 1.8V Operation
      2. 8.3.2 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Programmable Coefficient Registers: Page 27

This register page shown in Table 7-140 consists of the programmable coefficients for the AGC.

Table 7-139 Page 27 Programmable Coefficient Registers
ADDRESS REGISTER RESET DESCRIPTION
0x00 PAGE[7:0] 0x00 Device Page Register
0x5C AGC_NOISE_FLOOR_BYT1[7:0] 0xFF AGC Noise Floor coefficient byte[31:24]
0x5D AGC_NOISE_FLOOR_BYT2[7:0] 0xFE AGC Noise Floor coefficient byte[23:16]
0x5E AGC_NOISE_FLOOR_BYTT3[7:0] 0xB0 AGC Noise Floor coefficient byte[15:8]
0x5F AGC_NOISE_FLOOR_BYTT4[7:0] 0x00 AGC Noise Floor coefficient byte[7:0]
0x60 AGC_TARGET_LEVEL_BYT1[7:0] 0xFF AGC Target Level coefficient byte[31:24]
0x61 AGC_TARGET_LEVEL_BYT2[7:0] 0xFF AGC Target Level coefficient byte[23:16]
0x62 AGC_TARGET_LEVEL_BYTT3[7:0] 0x78 AGC Target Level coefficient byte[15:8]
0x63 AGC_TARGET_LEVEL_BYTT4[7:0] 0x00 AGC Target Level coefficient byte[7:0]
0x64 AGC_NOISE_COUNT_MAX_BYT1[7:0] 0x00 AGC Noise Floor Hold Count coefficient byte[31:24]
0x65 AGC_NOISE_COUNT_MAX_BYT2[7:0] 0x00 AGC Noise Floor Hold Count coefficient byte[23:16]
0x66 AGC_NOISE_COUNT_MAX_BYTT3[7:0] 0x04 AGC Noise Floor Hold Count coefficient byte[15:8]
0x67 AGC_NOISE_COUNT_MAX_BYTT4[7:0] 0xB0 AGC Noise Floor Hold Count coefficient byte[7:0]
0x68 AGC_MAX_GAIN_BYT1[7:0] 0x00 AGC Maximum Gain coefficient byte[31:24]
0x69 AGC_MAX_GAIN_BYT2[7:0] 0x00 AGC Maximum Gain coefficient byte[23:16]
0x6A AGC_MAX_GAIN_BYTT3[7:0] 0x60 AGC Maximum Gain coefficient byte[15:8]
0x6B AGC_MAX_GAIN_BYTT4[7:0] 0x00 AGC Maximum Gain coefficient byte[7:0]
0x6C AGC_MIN_GAIN_BYT1[7:0] 0xFF AGC Minimum Gain coefficient byte[31:24]
0x6D AGC_MIN_GAIN_BYT2[7:0] 0xFF AGC Minimum Gain coefficient byte[23:16]
0x6E AGC_MIN_GAIN_BYTT3[7:0] 0x88 AGC Minimum Gain coefficient byte[15:8]
0x6F AGC_MIN_GAIN_BYTT4[7:0] 0x00 AGC Minimum Gain coefficient byte[7:0]
0x70 AGC_NOISE_HYS_BYT1[7:0] 0x00 AGC Noise Gate Hysteresis coefficient byte[31:24]
0x71 AGC_NOISE_HYS_BYT2[7:0] 0x00 AGC Noise Gate Hysteresis coefficient byte[23:16]
0x72 AGC_NOISE_HYS_BYTT3[7:0] 0x18 AGC Noise Gate Hysteresis coefficient byte[15:8]
0x73 AGC_NOISE_HYS_BYTT4[7:0] 0x00 AGC Noise Gate Hysteresis coefficient byte[7:0]
0x74 AGC_ATTACK_HOLD_COUNT_BYT1[7:0] 0x00 AGC Attack Hold Count coefficient byte[31:24]
0x75 AGC_ATTACK_HOLD_COUNT_BYT2[7:0] 0x00 AGC Attack Hold Count coefficient byte[23:16]
0x76 AGC_ATTACK_HOLD_COUNT_BYTT3[7:0] 0x00 AGC Attack Hold Count coefficient byte[15:8]
0x77 AGC_ATTACK_HOLD_COUNT_BYTT4[7:0] 0x01 AGC Attack Hold Count coefficient byte[7:0]
0x78 AGC_RELEASE_HOLD_COUNT_BYT1[7:0] 0x00 AGC Release Hold Count coefficient byte[31:24]
0x79 AGC_RELEASE_HOLD_COUNT_BYT2[7:0] 0x00 AGC Release Hold Count coefficient byte[23:16]
0x7A AGC_RELEASE_HOLD_COUNT_BYTT3[7:0] 0x04 AGC Release Hold Count coefficient byte[15:8]
0x7B AGC_RELEASE_HOLD_COUNT_BYTT4[7:0] 0xB0 AGC Release Hold Count coefficient byte[7:0]
0x7C AGC_RELEASE_HYST_BYT1[7:0] 0x00 AGC Release Hysteresis coefficient byte[31:24]
0x7D AGC_RELEASE_HYST_BYT2[7:0] 0x00 AGC Release Hysteresis coefficient byte[23:16]
0x7E AGC_RELEASE_HYST_BYTT3[7:0] 0x08 AGC Release Hysteresis coefficient byte[15:8]
0x7F AGC_RELEASE_HYST_BYTT4[7:0] 0x00 AGC Release Hysteresis coefficient byte[7:0]