SLASF30A January   2022  – December 2024 TAA5212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: I2C Interface
    7. 5.7  Switching Characteristics: I2C Interface
    8. 5.8  Timing Requirements: SPI Interface
    9. 5.9  Switching Characteristics: SPI Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 5.12 Timing Requirements: PDM Digital Microphone Interface
    13. 5.13 Switching Characteristics: PDM Digital Microphone Interface
    14. 5.14 Timing Diagrams
    15. 5.15 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3  Input Channel Configurations
      4. 6.3.4  Reference Voltage
      5. 6.3.5  Programmable Microphone Bias
      6. 6.3.6  Signal-Chain Processing
        1. 6.3.6.1 ADC Signal-Chain
          1. 6.3.6.1.1  6 to 4 Input Select Multiplexer (6:4 MUX)
          2. 6.3.6.1.2  Programmable Channel Gain and Digital Volume Control
          3. 6.3.6.1.3  Programmable Channel Gain Calibration
          4. 6.3.6.1.4  Programmable Channel Phase Calibration
          5. 6.3.6.1.5  Programmable Digital High-Pass Filter
          6. 6.3.6.1.6  Programmable Digital Biquad Filters
          7. 6.3.6.1.7  Programmable Channel Summer and Digital Mixer
          8. 6.3.6.1.8  Configurable Digital Decimation Filters
            1. 6.3.6.1.8.1 Linear-phase filters
              1. 6.3.6.1.8.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.6.1.8.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.6.1.8.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.6.1.8.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.6.1.8.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.6.1.8.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.6.1.8.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.6.1.8.2 Low-latency Filters
              1. 6.3.6.1.8.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.6.1.8.3 Ultra Low-latency Filters
              1. 6.3.6.1.8.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.6.1.8.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.6.1.8.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.6.1.8.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.6.1.8.3.5 Sampling Rate: 192kHz or 176.4kHz
          9. 6.3.6.1.9  Automatic Gain Controller (AGC)
          10. 6.3.6.1.10 Voice Activity Detection (VAD)
          11. 6.3.6.1.11 Ultrasonic Activity Detection (UAD)
      7. 6.3.7  Digital PDM Microphone Record Channel
      8. 6.3.8  Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9  Power Tune Mode
      10. 6.3.10 Incremental ADC (IADC) Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Active Mode
      3. 6.4.3 Software Reset
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 I2C Control Interface
          1. 6.5.1.1.1 General I2C Operation
          2. 6.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 6.5.1.1.2.1 I2C Single-Byte Write
            2. 6.5.1.1.2.2 I2C Multiple-Byte Write
            3. 6.5.1.1.2.3 I2C Single-Byte Read
            4. 6.5.1.1.2.4 I2C Multiple-Byte Read
        2. 6.5.1.2 SPI Control Interface
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAA5212_B0_P0 Registers
      2. 7.1.2 TAA5212_B0_P1 Registers
      3. 7.1.3 TAA5212_B0_P3 Registers
    2. 7.2 Programmable Coefficienct Registers
      1. 7.2.1 Programmable Coefficient Registers: Page 8
      2. 7.2.2 Programmable Coefficient Registers: Page 9
      3. 7.2.3 Programmable Coefficient Registers: Page 10
      4. 7.2.4 Programmable Coefficient Registers: Page 11
      5. 7.2.5 Programmable Coefficient Registers: Page 19
      6. 7.2.6 Programmable Coefficient Registers: Page 27
      7. 7.2.7 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Performance Plots
      5. 8.2.5 Example Device Register Configuration Scripts for EVM Setup
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 AVDD_MODE for 1.8V Operation
      2. 8.3.2 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.5 Programmable Microphone Bias

The device integrates a built-in, low-noise microphone bias pin that can be used in the system for biasing electret-condenser microphones or providing the supply to the MEMS analog or digital microphone. The integrated bias amplifier supports up to 5 mA of load current that can be used for multiple microphones and is designed to provide a combination of high PSRR, low noise, and programmable bias voltages to allow the biasing to be fine tuned for specific microphone combinations.

When using this MICBIAS pin for biasing or supplying to multiple microphones, avoid any common impedance on the board layout for the MICBIAS connection to minimize coupling across microphones. Table 6-13 shows the available microphone bias programmable options.

Table 6-13 MICBIAS Programmable Settings
P0_R77_D[3:2] : MICBIAS_VAL[1:0] P0_R77_D[1:0] : VREF_FSCALE[1:0] MICBIAS OUTPUT VOLTAGE
00 (default) 00 (default) 2.75 V (same as the VREF output)
01 2.5 V (same as the VREF output)
10 1.375 V (same as the VREF output)
11 Reserved (do not use these settings)
01 00 (default) 1.375 V (0.5 times the VREF output)
01 1.250 V (0.5 times the VREF output)
10 or 11 Reserved (do not use these settings)
10 XX Reserved (do not use these settings)
11 XX Same as AVDD

The microphone bias output can be powered on or powered off (default) by configuring the MICBIAS_PDZ (P0_R120_D[5]) register bit. Additionally, the device provides an option to configure the GPIOx or GPI1 pin to directly control the microphone bias output powering on or off. This feature is useful to control the microphone directly without engaging the host for I2C or SPI communication. The MICBIAS_PDZ (P0_R120_D[5]) register bit value is ignored if the GPIOx or GPI1 pin is configured to set the microphone bias off.