SLASF30 January   2022 TAA5212

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 6.12 Timing Requirements: PDM Digital Microphone Interface
    13. 6.13 Switching Characteristics: PDM Digial Microphone Interface
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Hardware Control
      2. 8.3.2 Serial Interfaces
        1. 8.3.2.1 Control Serial Interfaces
        2. 8.3.2.2 Audio Serial Interfaces
          1. 8.3.2.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.2.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.2.2.3 Left-Justified (LJ) Interface
        3. 8.3.2.3 Using Multiple Devices With Shared Buses
      3. 8.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 8.3.4 Input Channel Configurations
      5. 8.3.5 Reference Voltage
      6. 8.3.6 Programmable Microphone Bias
      7. 8.3.7 Signal-Chain Processing
        1. 8.3.7.1 ADC Signal-Chain
          1. 8.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 8.3.7.1.2 Programmable Channel Gain Calibration
          3. 8.3.7.1.3 Programmable Channel Phase Calibration
          4. 8.3.7.1.4 Programmable Digital High-Pass Filter
          5. 8.3.7.1.5 Programmable Digital Biquad Filters
          6. 8.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 8.3.7.1.7 Configurable Digital Decimation Filters
            1. 8.3.7.1.7.1 Linear Phase Filters
              1. 8.3.7.1.7.1.1 Sampling Rate: 16 kHz or 14.7 kHz
              2. 8.3.7.1.7.1.2 Sampling Rate: 24 kHz or 22.05 kHz
              3. 8.3.7.1.7.1.3 Sampling Rate: 32 kHz or 29.4 kHz
              4. 8.3.7.1.7.1.4 Sampling Rate: 48 kHz or 44.1 kHz
              5. 8.3.7.1.7.1.5 Sampling Rate: 96 kHz or 88.2 kHz
      8. 8.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 8.3.9 Programmable Channel Phase Calibration
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 VEGA Registers
      2. 8.5.2 TAA5212 Registers
      3. 8.5.3 TAA5212 Registers
    6. 8.6 Feature Description
    7. 8.7 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Performance Plots
      5. 9.2.5 What to Do and What Not to Do
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TAA5212 UNIT
RGE (WQFN)
28 PINS
RθJA Junction-to-ambient thermal resistance 38.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.3 °C/W
RθJB Junction-to-board thermal resistance 15.9 °C/W
ψJT Junction-to-top characterization parameter 0.5 °C/W
ψJB Junction-to-board characterization parameter 15.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 13.8 °C/W
(1) For more information about traditional and new thermal metrics, see the spra953 application report.