SLASFC2 January   2024 TAC5112-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 6.12 Timing Requirements: PDM Digital Microphone Interface
    13. 6.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 6.14 Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Input Channel Configurations
      4. 7.3.4 Output Channel Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 Programmable Microphone Bias
      7. 7.3.7 Signal-Chain Processing
        1. 7.3.7.1 ADC Signal-Chain
          1. 7.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.1.2 Programmable Channel Gain Calibration
          3. 7.3.7.1.3 Programmable Channel Phase Calibration
          4. 7.3.7.1.4 Programmable Digital High-Pass Filter
          5. 7.3.7.1.5 Programmable Digital Biquad Filters
          6. 7.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 7.3.7.1.7 Configurable Digital Decimation Filters
            1. 7.3.7.1.7.1 Linear Phase Filters
              1. 7.3.7.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 7.3.7.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 7.3.7.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 7.3.7.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 7.3.7.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 7.3.7.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
        2. 7.3.7.2 DAC Signal-Chain
          1. 7.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.2.2 Programmable Channel Gain Calibration
          3. 7.3.7.2.3 Programmable Digital High-Pass Filter
          4. 7.3.7.2.4 Programmable Digital Biquad Filters
          5. 7.3.7.2.5 Programmable Digital Mixer
          6. 7.3.7.2.6 Configurable Digital Interpolation Filters
            1. 7.3.7.2.6.1 Linear Phase Filters
              1. 7.3.7.2.6.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 7.3.7.2.6.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 7.3.7.2.6.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 7.3.7.2.6.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 7.3.7.2.6.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 7.3.7.2.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
  9. 8 Register Maps
    1. 8.1 TAC5212 Registers
    2. 8.2 TAC5212 Registers
    3. 8.3 TAC5212 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
  11. 10Power Supply Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing

Certain events in the device require host processor intervention and can be used to trigger interrupts to the host processor. One such event is an audio serial interface (ASI) bus error. The device powers down the record channels if any faults are detected with the ASI bus error clocks, such as:

  • Invalid FSYNC frequency
  • Invalid SBCLK to FSYNC ratio
  • Long pauses of the SBCLK or FSYNC clocks

When an ASI bus clock error is detected, the device shuts down all the record and playback channels as quickly as possible. After all ASI bus clock errors are resolved, the device volume ramps back to its previous state to recover the audio. During an ASI bus clock error, the internal interrupt request (IRQ) interrupt signal asserts low if the clock error interrupt mask register bit INT_MASK0[7] (P1_R47_D7) is set low. The clock fault is also available for readback in the latched fault status register bit INT_LTCH0 (P1_R52), which is a read-only register. Reading the latched fault status register, INT_LTCH0, clears all latched fault status. The device can be additionally configured to route the internal IRQ interrupt signal on the GPIOx or GPO1 pins and also can be configured as open-drain outputs so that these pins can be wire-ANDed to the open-drain interrupt outputs of other devices.

The IRQ interrupt signal can either be configured as active low or active high polarity by setting the INT_POL (P0_R66_D7) register bit. This signal can also be configured as a single pulse or a series of pulses by programming the INT_EVENT[1:0] (P0_R66_D[6:5]) register bits. If the interrupts are configured as a series of pulses, the events trigger the start of pulses that stop when the latched fault status register is read to determine the cause of the interrupt.

The device also supports read-only live-status registers to determine if the channels are powered up or down and if the device is in sleep mode or not. These status registers are located in the DEV_STS0 (P0_R121) and DEV_STS1 (P0_R122) register bits.

The device has a multifunctional GPIO1 pin that can be configured for a desired specific function. Table 7-40 lists all possible allocations of these multifunctional pins for the various features.

Table 7-40 Multifunction Pin Assignments
ROW PIN FUNCTION GPIO1 GPIO2 GPO1 GPI1
— — GPIO1_CFG GPO2_CFG GPO1_CFG GPI1_CFG
— — P0_R10[7:4] P0_R11[7:4] P0_R12[7:4] P0_R13[1]
A Pin disabled S(1) S (default) S (default) S (default)
B General-purpose output (GPO) S S S NS(2)
C Interrupt output (IRQ) S (default) S S NS
D Power down for all ADC channels S S NS S
E Power down for all DAC channels S S NS S
F PDM clock output (PDMCLK) S S S NS
G MiCBIAS on/off input (BIASEN) S S NS S
H General-purpose input (GPI) S S NS S
I Controller clock input (CCLK) S S S S
J ASI daisy-chain input S S NS S
K PDM data input 1 (PDMDIN1) S S NS S
L PDM data input 2 (PDMDIN2) S S NS S
M ASI DOUT S S S NS
N ASI BCLK S S S S
O ASI FSYNC S S S S
P General Purpose Clock Out S S S NS
Q ASI daisy-chain output S S S NS
R Incremental ADC Conversion Start S S NS S
(1) S means the feature mentioned in this row is supported for the respective GPIO1, GPOx, or GPIx pin mentioned in this column.
(2) NS means the feature mentioned in this row is not supported for the respective GPIO1, GPOx, or GPIx pin mentioned in this column.

Each GPOx or GPIOx pin can be independently set for the desired drive configurations setting using the GPIOx_DRV[2:0] or GPO1_DRV[2:0] register bits. Table 7-41 lists the drive configuration settings.

Table 7-41 GPIO or GPOx Pins Drive Configuration Settings
P0_R10_D[2:0] : GPIO1_DRV[2:0] GPIO OUTPUT DRIVE CONFIGURATION SETTINGS FOR GPIO1
000 The GPIO1 pin is set to high impedance (floated)
001 The GPIO1 pin is set to be driven active low or active high
010 (default) The GPIO1 pin is set to be driven active low or weak high (on-chip pullup)
011 The GPIO1 pin is set to be driven active low or Hi-Z (floated)
100 The GPIO1 pin is set to be driven weak low (on-chip pulldown) or active high
101 The GPIO1 pin is set to be driven Hi-Z (floated) or active high
110 and 111 Reserved (do not use these settings)

Similarly, the GPO1 pin can be configured using the GPO1_DRV(P0_R12) register bits.

When configured as a general-purpose output (GPO), the GPIOx or GPO1 pin values can be driven by writing the GPO_GPI_VAL (P0_R14) registers. The GPIO_MON bits (P0_R14_D[3:1]) can be used to readback the status of the GPIOx or GPI1 pin when configured as a general-purpose input (GPI).