SLASFC4 January   2024 TAC5212-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 6.12 Timing Requirements: PDM Digital Microphone Interface
    13. 6.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 6.14 Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Input Channel Configurations
      4. 7.3.4 Output Channel Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 Programmable Microphone Bias
      7. 7.3.7 Signal-Chain Processing
        1. 7.3.7.1 ADC Signal-Chain
          1. 7.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.1.2 Programmable Channel Gain Calibration
          3. 7.3.7.1.3 Programmable Channel Phase Calibration
          4. 7.3.7.1.4 Programmable Digital High-Pass Filter
          5. 7.3.7.1.5 Programmable Digital Biquad Filters
          6. 7.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 7.3.7.1.7 Configurable Digital Decimation Filters
            1. 7.3.7.1.7.1 Linear Phase Filters
              1. 7.3.7.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 7.3.7.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 7.3.7.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 7.3.7.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 7.3.7.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 7.3.7.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
        2. 7.3.7.2 DAC Signal-Chain
          1. 7.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.2.2 Programmable Channel Gain Calibration
          3. 7.3.7.2.3 Programmable Digital High-Pass Filter
          4. 7.3.7.2.4 Programmable Digital Biquad Filters
          5. 7.3.7.2.5 Programmable Digital Mixer
          6. 7.3.7.2.6 Configurable Digital Interpolation Filters
            1. 7.3.7.2.6.1 Linear Phase Filters
              1. 7.3.7.2.6.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 7.3.7.2.6.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 7.3.7.2.6.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 7.3.7.2.6.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 7.3.7.2.6.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 7.3.7.2.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
  9. 8 Register Maps
    1. 8.1 TAC5212 Registers
    2. 8.2 TAC5212 Registers
    3. 8.3 TAC5212 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
  11. 10Power Supply Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.5 Reference Voltage

All audio data converters require a DC reference voltage. The TAC5212-Q1 achieves low-noise performance by internally generating a low-noise reference voltage. This reference voltage is generated using a band-gap circuit with high PSRR performance. This audio converter reference voltage must be filtered externally using a minimum 1-µF capacitor connected from the VREF pin to the analog ground (VSS).

The value of this reference voltage can be configured using the P0_R77_D[1:0] register bits and must be set to an appropriate value based on the desired full-scale input for the device and the AVDD supply voltage available in the system. The default VREF value is set to 2.75 V, which in turn supports a 2-VRMS differential full-scale input to the device. The required minimum AVDD voltage for this mode is 3 V. The TAC5212-Q1 also supports double swing mode with 4-VRMS differential swing which can be enabled by setting ADC_CHx_FULLSCALE_VAL to 1. lTable 7-12 lists the various VREF settings supported along with the required AVDD range and the supported full-scale input signal for that configuration.

Table 7-12 VREF Programmable Settings
P0_R77_D[1:0]: VREF[1:0]VREF OUTPUT VOLTAGE DIFFERENTIAL FULL-SCALE INPUT SUPPORTEDSINGLE-ENDED FULL-SCALE INPUT SUPPORTEDAVDD RANGE REQUIREMENT
00 (default)2.75 V2 VRMS (4 VRMS supported in high swing mode)1 VRMS3 V to 3.6 V
012.5 V1.818 VRMS0.909 VRMS2.8 V to 3.6 V
101.375 V1 VRMS0.5 VRMS1.7 V to 1.9 V
11ReservedReservedReservedReserved

To achieve low power consumption, this audio reference block is powered down as described in the Device Functional Modes section. When exiting sleep mode, the audio reference block is powered up using the internal fast-charge scheme and the VREF pin settles to its steady-state voltage after the settling time (a function of the decoupling capacitor on the VREF pin). This time is approximately equal to 3.5 ms when using a 1-μF decoupling capacitor. If a higher-value decoupling capacitor is used on the VREF pin, the fast-charge setting must be reconfigured using the VREF_QCHG (P0_R2_D[4:3]) register bits, which support options of 3.5 ms (default), 10 ms, 50 ms, or 100 ms.