SLASFC4 January   2024 TAC5212-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 6.12 Timing Requirements: PDM Digital Microphone Interface
    13. 6.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 6.14 Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Input Channel Configurations
      4. 7.3.4 Output Channel Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 Programmable Microphone Bias
      7. 7.3.7 Signal-Chain Processing
        1. 7.3.7.1 ADC Signal-Chain
          1. 7.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.1.2 Programmable Channel Gain Calibration
          3. 7.3.7.1.3 Programmable Channel Phase Calibration
          4. 7.3.7.1.4 Programmable Digital High-Pass Filter
          5. 7.3.7.1.5 Programmable Digital Biquad Filters
          6. 7.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 7.3.7.1.7 Configurable Digital Decimation Filters
            1. 7.3.7.1.7.1 Linear Phase Filters
              1. 7.3.7.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 7.3.7.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 7.3.7.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 7.3.7.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 7.3.7.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 7.3.7.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
        2. 7.3.7.2 DAC Signal-Chain
          1. 7.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.2.2 Programmable Channel Gain Calibration
          3. 7.3.7.2.3 Programmable Digital High-Pass Filter
          4. 7.3.7.2.4 Programmable Digital Biquad Filters
          5. 7.3.7.2.5 Programmable Digital Mixer
          6. 7.3.7.2.6 Configurable Digital Interpolation Filters
            1. 7.3.7.2.6.1 Linear Phase Filters
              1. 7.3.7.2.6.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 7.3.7.2.6.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 7.3.7.2.6.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 7.3.7.2.6.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 7.3.7.2.6.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 7.3.7.2.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
  9. 8 Register Maps
    1. 8.1 TAC5212 Registers
    2. 8.2 TAC5212 Registers
    3. 8.3 TAC5212 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
  11. 10Power Supply Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

The power-supply sequence between the IOVDD and AVDD rails can be applied in any order. However, after all supplies are stable, then only initiate the I2C or SPI transactions to initialize the device.

For the supply power-up requirement, t1, t2 must be at least 2 ms to allow the device to initialize the internal registers. See the Section 7.4 section for details on how the device operates in various modes after the device power supplies are settled to the recommended operating voltage levels. For the supply power-down requirement, t4, t5 and t6 must be at least 10 ms. This timing (as shown in Figure 10-1) allows the device to ramp down the volume on the record data, power down the analog and digital blocks, and put the device into shutdown mode. The device can also be immediately put into shutdown mode by ramping down power supplies, but doing so causes an abrupt shutdown.

GUID-20231211-SS0I-DVBZ-PDVQ-JJB31KXGZP9R-low.svg Figure 10-1 Power-Supply Sequencing Requirement Timing Diagram

Make sure that the supply ramp rate is slower than 0.1V/µs and that the wait time between a power-down and a power-up event is at least 100 ms. For supply ramp rate slower than 0.1 V/ms, host device must apply a software reset as first transaction before doing any device configuration. Make sure all digital input pins are at valid input levels and not toggling during supply sequencing.

The TAC5212-Q1 supports a single AVDD supply operation by integrating an on-chip digital regulator, DREG, and an analog regulator, AREG.