SLASF23 December   2023 TAC5212

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
    12. 6.12 Timing Requirements: PDM Digital Microphone Interface
    13. 6.13 Switching Characteristics: PDM Digial Microphone Interface
    14. 6.14 Timing Diagrams
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
      2. 7.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 7.3.3 Input Channel Configurations
      4. 7.3.4 Output Channel Configurations
      5. 7.3.5 Reference Voltage
      6. 7.3.6 Programmable Microphone Bias
      7. 7.3.7 Signal-Chain Processing
        1. 7.3.7.1 ADC Signal-Chain
          1. 7.3.7.1.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.1.2 Programmable Channel Gain Calibration
          3. 7.3.7.1.3 Programmable Channel Phase Calibration
          4. 7.3.7.1.4 Programmable Digital High-Pass Filter
          5. 7.3.7.1.5 Programmable Digital Biquad Filters
          6. 7.3.7.1.6 Programmable Channel Summer and Digital Mixer
          7. 7.3.7.1.7 Configurable Digital Decimation Filters
            1. 7.3.7.1.7.1 Linear Phase Filters
              1. 7.3.7.1.7.1.1 Sampling Rate: 16 kHz or 14.7 kHz
              2. 7.3.7.1.7.1.2 Sampling Rate: 24 kHz or 22.05 kHz
              3. 7.3.7.1.7.1.3 Sampling Rate: 32 kHz or 29.4 kHz
              4. 7.3.7.1.7.1.4 Sampling Rate: 48 kHz or 44.1 kHz
              5. 7.3.7.1.7.1.5 Sampling Rate: 96 kHz or 88.2 kHz
              6. 7.3.7.1.7.1.6 Sampling Rate: 384 kHz or 352.8 kHz
        2. 7.3.7.2 DAC Signal-Chain
          1. 7.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 7.3.7.2.2 Programmable Channel Gain Calibration
          3. 7.3.7.2.3 Programmable Digital High-Pass Filter
          4. 7.3.7.2.4 Programmable Digital Biquad Filters
          5. 7.3.7.2.5 Programmable Digital Mixer
          6. 7.3.7.2.6 Configurable Digital Interpolation Filters
            1. 7.3.7.2.6.1 Linear Phase Filters
              1. 7.3.7.2.6.1.1 Sampling Rate: 16 kHz or 14.7 kHz
              2. 7.3.7.2.6.1.2 Sampling Rate: 24 kHz or 22.05 kHz
              3. 7.3.7.2.6.1.3 Sampling Rate: 32 kHz or 29.4 kHz
              4. 7.3.7.2.6.1.4 Sampling Rate: 48 kHz or 44.1 kHz
              5. 7.3.7.2.6.1.5 Sampling Rate: 96 kHz or 88.2 kHz
              6. 7.3.7.2.6.1.6 Sampling Rate: 384 kHz or 352.8 kHz
      8. 7.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 TAC5212 Registers
      2. 7.5.2 TAC5212 Registers
      3. 7.5.3 TAC5212 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface

In TDM mode, also known as DSP mode, the rising edge of FSYNC starts the data transfer with the slot 0 data first. Immediately after the slot 0 data transmission, the remaining slot data are transmitted in order. FSYNC and each data bit (except the MSB of slot 0 when TX_OFFSET equals 0) is transmitted on the rising edge of BCLK. Figure 7-2 to Figure 7-5 illustrate the protocol timing for TDM operation with various configurations.

GUID-8E17DFB9-8743-4E2E-AB2F-D14C93FDCFF1-low.gifFigure 7-2 TDM Mode Standard Protocol Timing (PASI_TX_OFFSET = 0)
GUID-20C86F12-3750-4DA3-A3FA-1174AA8BFEEA-low.gifFigure 7-3 TDM Mode Protocol Timing (PASI_TX_OFFSET = 2)
GUID-F55627ED-7EB8-4204-A59A-DFFE5F29FB5D-low.gifFigure 7-4 TDM Mode Protocol Timing (No Idle BCLK Cycles, PASI_TX_OFFSET = 2)
GUID-342961AB-C302-472C-8B74-34667D180907-low.gifFigure 7-5 TDM Mode Protocol Timing (PASI_TX_OFFSET = 0 and PASI_BCLK_POL = 1)

For proper operation of the audio bus in TDM mode, the number of bit clocks per frame must be greater than or equal to the number of active output channels times the programmed word length of the output channel data. The device supports FSYNC as a pulse with a 1-cycle-wide bit clockbut also supports multiples as well. For a higher BCLK frequency operation, using TDM mode with a PASI_TX_OFFSET value higher than 0 is recommended.