SLASF27
December 2023
TAC5242
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device Comparison Table
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements: TDM, I2S or LJ Interface
6.7
Switching Characteristics: TDM, I2S or LJ Interface
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Hardware Control
8.3.2
Audio Serial Interfaces
8.3.2.1
Time Division Multiplexed Audio (TDM) Interface
8.3.2.2
Inter IC Sound (I2S) Interface
8.3.3
Phase-Locked Loop (PLL) and Clock Generation
8.3.4
Analog Input Output Configurations
8.3.5
Reference Voltage
8.3.6
ADC Signal-Chain
8.3.6.1
Digital High-Pass Filter
8.3.6.2
Configurable Digital Decimation Filters
8.3.6.2.1
Linear Phase Filters
8.3.6.2.1.1
Sampling Rate: 16 kHz or 14.7 kHz
8.3.6.2.1.2
Sampling Rate: 24 kHz or 22.05 kHz
8.3.6.2.1.3
Sampling Rate: 32 kHz or 29.4 kHz
8.3.6.2.1.4
Sampling Rate: 48 kHz or 44.1 kHz
8.3.6.2.1.5
Sampling Rate: 96 kHz or 88.2 kHz
8.3.7
DAC Signal-Chain
8.3.7.1
Configurable Digital Interpolation Filters
8.3.7.1.1
Linear Phase Filters
8.3.7.1.1.1
Sampling Rate: 16 kHz or 14.7 kHz
8.3.7.1.1.2
Sampling Rate: 24 kHz or 22.05 kHz
8.3.7.1.1.3
Sampling Rate: 32 kHz or 29.4 kHz
8.3.7.1.1.4
Sampling Rate: 48 kHz or 44.1 kHz
8.3.7.1.1.5
Sampling Rate: 96 kHz or 88.2 kHz
8.3.7.1.1.6
Sampling Rate: 384 kHz or 352.8 kHz
8.4
Device Functional Modes
8.4.1
Active Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Application
9.2.2
Design Requirements
9.2.3
Detailed Design Procedure
10
Power Supply Recommendations
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Revision History
13
Mechanical, Packaging, and Orderable Information
13.1
Tape and Reel Information
Package Options
Mechanical Data (Package|Pins)
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slasf27_oa
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002
(1)
±2000
V
V
(ESD)
Electrostatic discharge
Charged-device model (CDM), per AEC Q100-011
±500
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.