SLASF35 January   2024 TAC5312-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Thermal Information
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics
    8. 5.8  Timing Requirements: I2C Interface
    9. 5.9  Switching Characteristics: I2C Interface
    10. 5.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 5.11 Switching Characteristics: TDM, I2S or LJ Interface
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
      2. 6.3.2  Using Multiple Devices With Shared Buses
      3. 6.3.3  Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4  Input Channel Configuration
      5. 6.3.5  Reference Voltage
      6. 6.3.6  Microphone Bias
      7. 6.3.7  Input DC Fault Diagnostics
        1. 6.3.7.1 Fault Conditions
          1. 6.3.7.1.1 Input Pin Short to Ground
          2. 6.3.7.1.2 Input Pin Short to MICBIAS
          3. 6.3.7.1.3 Open Inputs
          4. 6.3.7.1.4 Short Between INxP and INxM
          5. 6.3.7.1.5 Input Pin Overvoltage
          6. 6.3.7.1.6 Input Pin Short to VBAT_IN
        2. 6.3.7.2 Fault Reporting
          1. 6.3.7.2.1 Overcurrent and Overtemperature Protection
      8. 6.3.8  Signal-Chain Processing
        1. 6.3.8.1 ADC Signal-Chain
          1. 6.3.8.1.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.8.1.2 Programmable Channel Gain Calibration
          3. 6.3.8.1.3 Programmable Channel Phase Calibration
          4. 6.3.8.1.4 Programmable Digital High-Pass Filter
          5. 6.3.8.1.5 Programmable Digital Biquad Filters
          6. 6.3.8.1.6 Programmable Channel Summer and Digital Mixer
          7. 6.3.8.1.7 Configurable Digital Decimation Filters
            1. 6.3.8.1.7.1 Linear Phase Filters
              1. 6.3.8.1.7.1.1 Sampling Rate: 16kHz or 14.7kHz
              2. 6.3.8.1.7.1.2 Sampling Rate: 24kHz or 22.05kHz
              3. 6.3.8.1.7.1.3 Sampling Rate: 32kHz or 29.4kHz
              4. 6.3.8.1.7.1.4 Sampling Rate: 48kHz or 44.1kHz
              5. 6.3.8.1.7.1.5 Sampling Rate: 96kHz or 88.2kHz
              6. 6.3.8.1.7.1.6 Sampling Rate: 384kHz or 352.8kHz
      9. 6.3.9  DAC Signal-Chain
        1. 6.3.9.1 Programmable Channel Gain and Digital Volume Control
        2. 6.3.9.2 Programmable Channel Gain Calibration
        3. 6.3.9.3 Programmable Digital High-Pass Filter
        4. 6.3.9.4 Programmable Digital Biquad Filters
        5. 6.3.9.5 Programmable Digital Mixer
        6. 6.3.9.6 Configurable Digital Interpolation Filters
          1. 6.3.9.6.1 Linear Phase Filters
            1. 6.3.9.6.1.1 Sampling Rate: 16kHz or 14.7kHz
            2. 6.3.9.6.1.2 Sampling Rate: 24kHz or 22.05kHz
            3. 6.3.9.6.1.3 Sampling Rate: 32kHz or 29.4kHz
            4. 6.3.9.6.1.4 Sampling Rate: 48kHz or 44.1kHz
            5. 6.3.9.6.1.5 Sampling Rate: 96kHz or 88.2kHz
            6. 6.3.9.6.1.6 Sampling Rate: 384kHz or 352.8kHz
      10. 6.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
  8. 7 Register Maps
    1. 7.1 Page 0 Registers
    2. 7.2 Page 1 Registers
    3. 7.3 Page_3 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.3 Detailed Design Procedure

This section describes the necessary steps to configure the TAC5312-Q1 for this specific application. The following steps provide a sequence of items that must be executed in the time between powering the device up and reading data from the device or transitioning from one mode to another mode of operation.

  1. Apply power to the device:
    1. Power up the IOVDD, BSTVDD and AVDD power supplies
    2. Wait for at least 1ms to allow the device to initialize the internal registers.
    3. The device now goes into sleep mode (low-power mode < 10 µA)
  2. Transition from sleep mode to active mode whenever required for the operation:
    1. Wake up the device by writing to P0_R2 to disable sleep mode
    2. Wait for at least 1 ms to allow the device to complete the internal wake-up sequence
    3. Override the default configuration registers or programmable coefficients value as required (this step is optional)
    4. Enable all desired input channels by writing to P0_R118
    5. Enable all desired audio serial interface input/output channels by writing to P0_R40 to P0_R47 for DAC and P0_R30 to P0_R37 for ADC
    6. Power-up the ADC, DAC and MICBIAS by writing to P0_R120
    7. Apply FSYNC and BCLK with the desired output sample rates and the BCLK to FSYNC ratio

      This specific step can be done at any point in the sequence after step a.

      See the Section 6.3.3 section for supported sample rates and the BCLK to FSYNC ratio.

    8. The device recording data is now sent to the host processor using the TDM audio serial data bus and playback data from TDM is now played on the lineout
  3. Transition from active mode to sleep mode (again) as required in the system for low-power operation:
    1. Enter sleep mode by writing to P0_R2 to enable sleep mode
    2. Wait at least 6 ms (when FSYNC = 48 kHz) for the volume to ramp down and for all blocks to power down
    3. Read P0_R122 to check the device shutdown and sleep mode status
    4. If the device P0_R122_D[7:5] status bit is 3'b100 then stop FSYNC and BCLK in the system
    5. The device now goes into sleep mode (low-power mode < 10 µA) and retains all register values
  4. Transition from sleep mode to active mode (again) as required for the recording operation:
    1. Wake up the device by writing to P0_R2 to disable sleep mode
    2. Wait at least 1 ms to allow the device to complete the internal wake-up sequence
    3. Apply FSYNC and BCLK with the desired output sample rates and the BCLK to FSYNC ratio
    4. The device recording data is now sent to the host processor using the TDM audio serial data bus and playback data from TDM is now played on the lineout
  5. Repeat step 4 and step 5 as required for mode transitions