SLASF32A December   2023  – October 2024 TAD5142

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
        3. 6.3.2.3 Left-Justified (LJ) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Analog Output Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 DAC Signal-Chain
        1. 6.3.6.1 Digital Interpolation Filters
          1. 6.3.6.1.1 Linear-phase filters
            1. 6.3.6.1.1.1 Sampling Rate: 8kHz or 7.35kHz
            2. 6.3.6.1.1.2 Sampling Rate: 16kHz or 14.7kHz
            3. 6.3.6.1.1.3 Sampling Rate: 24kHz or 22.05kHz
            4. 6.3.6.1.1.4 Sampling Rate: 32kHz or 29.4kHz
            5. 6.3.6.1.1.5 Sampling Rate: 48kHz or 44.1kHz
            6. 6.3.6.1.1.6 Sampling Rate: 96kHz or 88.2kHz
            7. 6.3.6.1.1.7 Sampling Rate: 192kHz or 176.4kHz
          2. 6.3.6.1.2 Low-latency Filters
            1. 6.3.6.1.2.1 Sampling Rate: 24kHz or 22.05kHz
            2. 6.3.6.1.2.2 Sampling Rate: 32kHz or 29.4kHz
            3. 6.3.6.1.2.3 Sampling Rate: 48kHz or 44.1kHz
            4. 6.3.6.1.2.4 Sampling Rate: 96kHz or 88.2kHz
            5. 6.3.6.1.2.5 Sampling Rate: 192kHz or 176.4kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Performance Plots
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

    • Stereo audio DAC performance:
      • DAC to differential line-out dynamic range: 110dB
      • DAC to pseudo-differential headphone-out dynamic range: 107dB
      • DAC to differential line-out THD+N: –100 dB
      • Output voltage:
        • Differential Line-out/Receiver, 2VRMS full-scale
        • Pseudo-differential Headphone, 1VRMS full-scale
        • Single-ended Line-out, 1VRMS full-scale
      • DAC sample rates (fs) = 8kHz to 192kHz
    • Key Features
      • Pin or Hardware Control
      • Audio Serial Interface
        • Format: TDM, LJ or I2S
        • Bus Controller and Target Modes
        • Daisy chain in TDM Mode
        • Word Length: Selectable 24 or 32 Bits
      • Pin-selectable digital interpolation filter options:
        • Linear-phase
        • Low-latency
      • Auto clock detection
      • Interrupt output on clock error
      • Single supply operation AVDD: 1.8V or 3.3V
      • I/O Supply Operation: 1.8V or 3.3V
      • Temperature grade 1: –40°C ≤ TA ≤ +125°C