SLASF38 December   2023 TAD5212-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Interface
    7. 6.7  Switching Characteristics: I2C Interface
    8. 6.8  Timing Requirements: SPI Interface
    9. 6.9  Switching Characteristics: SPI Interface
    10. 6.10 Timing Requirements: TDM, I2S or LJ Interface
    11. 6.11 Switching Characteristics: TDM, I2S or LJ Interface
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interfaces
        1. 7.3.1.1 Control Serial Interfaces
        2. 7.3.1.2 Audio Serial Interfaces
          1. 7.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 7.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 7.3.1.2.3 Left-Justified (LJ) Interface
        3. 7.3.1.3 Using Multiple Devices With Shared Buses
        4. 7.3.1.4 Phase-Locked Loop (PLL) and Clock Generation
        5. 7.3.1.5 Output Channel Configurations
        6. 7.3.1.6 Reference Voltage
        7. 7.3.1.7 Programmable Microphone Bias
        8. 7.3.1.8 Signal-Chain Processing
          1. 7.3.1.8.1 DAC Signal-Chain
            1. 7.3.1.8.1.1 Programmable Channel Gain and Digital Volume Control
            2. 7.3.1.8.1.2 Programmable Channel Gain Calibration
            3. 7.3.1.8.1.3 Programmable Digital High-Pass Filter
            4. 7.3.1.8.1.4 Programmable Digital Biquad Filters
            5. 7.3.1.8.1.5 Programmable Digital Mixer
            6. 7.3.1.8.1.6 Configurable Digital Interpolation Filters
              1. 7.3.1.8.1.6.1 Linear Phase Filters
                1. 7.3.1.8.1.6.1.1 Sampling Rate: 16 kHz or 14.7 kHz
                2. 7.3.1.8.1.6.1.2 Sampling Rate: 24 kHz or 22.05 kHz
                3. 7.3.1.8.1.6.1.3 Sampling Rate: 32 kHz or 29.4 kHz
                4. 7.3.1.8.1.6.1.4 Sampling Rate: 48 kHz or 44.1 kHz
                5. 7.3.1.8.1.6.1.5 Sampling Rate: 96 kHz or 88.2 kHz
                6. 7.3.1.8.1.6.1.6 Sampling Rate: 384 kHz or 352.8 kHz
        9. 7.3.1.9 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
      1. 7.5.1 TAD5212_P0 Registers
      2. 7.5.2 TAD5212_P1 Registers
      3. 7.5.3 TAD5212_P3 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.