SLASFC1A
December 2023 – January 2025
TAD5212
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements: I2C Interface
5.7
Switching Characteristics: I2C Interface
5.8
Timing Requirements: SPI Interface
5.9
Switching Characteristics: SPI Interface
5.10
Timing Requirements: TDM, I2S or LJ Interface
5.11
Switching Characteristics: TDM, I2S or LJ Interface
5.12
Timing Requirements: PDM Digital Microphone Interface
5.13
Switching Characteristics: PDM Digial Microphone Interface
5.14
Timing Diagrams
5.15
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Serial Interfaces
6.3.1.1
Control Serial Interfaces
6.3.1.2
Audio Serial Interfaces
6.3.1.2.1
Time Division Multiplexed Audio (TDM) Interface
6.3.1.2.2
Inter IC Sound (I2S) Interface
6.3.1.2.3
Left-Justified (LJ) Interface
6.3.1.3
Using Multiple Devices With Shared Buses
6.3.2
Phase-Locked Loop (PLL) and Clock Generation
6.3.3
Output Channel Configurations
6.3.4
Reference Voltage
6.3.5
Programmable Microphone Bias
6.3.6
Digital PDM Microphone Record Channel
6.3.7
Signal-Chain Processing
6.3.7.1
DAC Signal-Chain
6.3.7.1.1
Programmable Channel Gain and Digital Volume Control
6.3.7.1.2
Programmable Channel Gain Calibration
6.3.7.1.3
Programmable Digital High-Pass Filter
6.3.7.1.4
Programmable Digital Biquad Filters
6.3.7.1.5
Configurable Digital Interpolation Filters
6.3.7.1.5.1
Linear-phase filters
6.3.7.1.5.1.1
Sampling Rate: 8kHz or 7.35kHz
6.3.7.1.5.1.2
Sampling Rate: 16kHz or 14.7kHz
6.3.7.1.5.1.3
Sampling Rate: 24kHz or 22.05kHz
6.3.7.1.5.1.4
Sampling Rate: 32kHz or 29.4kHz
6.3.7.1.5.1.5
Sampling Rate: 48kHz or 44.1kHz
6.3.7.1.5.1.6
Sampling Rate: 96kHz or 88.2kHz
6.3.7.1.5.1.7
Sampling Rate: 192kHz or 176.4kHz
6.3.7.1.5.1.8
Sampling Rate: 384kHz or 352.8kHz
6.3.7.1.5.1.9
Sampling Rate 768kHz or 705.6kHz
6.3.7.1.5.2
Low-latency Filters
6.3.7.1.5.2.1
Sampling Rate: 24kHz or 22.05kHz
6.3.7.1.5.2.2
Sampling Rate: 32kHz or 29.4kHz
6.3.7.1.5.2.3
Sampling Rate: 48kHz or 44.1kHz
6.3.7.1.5.2.4
Sampling Rate: 96kHz or 88.2kHz
6.3.7.1.5.2.5
Sampling Rate: 192kHz or 176.4kHz
6.3.7.1.5.3
Ultra-Low-Latency Filters
6.3.7.1.5.3.1
Sampling Rate: 24 kHz or 22.05 kHz
6.3.7.1.5.3.2
Sampling Rate: 32 kHz or 29.4 kHz
6.3.7.1.5.3.3
Sampling Rate: 48 kHz or 44.1 kHz
6.3.7.1.5.3.4
Sampling Rate: 96 kHz or 88.2 kHz
6.3.7.1.5.3.5
Sampling Rate 192 kHz or 176.4 kHz
6.3.7.1.6
Programmable Digital Mixer
6.3.7.2
PDM Recording Signal-Chain
6.3.7.2.1
Programmable Channel Gain and Digital Volume Control
6.3.7.2.2
Programmable Channel Gain Calibration
6.3.7.2.3
Programmable Channel Phase Calibration
6.3.7.2.4
Programmable Digital High-Pass Filter
6.3.7.2.5
Programmable Digital Biquad Filters
6.3.7.2.6
Configurable Digital Decimation Filters
6.3.7.2.6.1
Linear-phase filters
6.3.7.2.6.1.1
Sampling Rate: 8kHz or 7.35kHz
6.3.7.2.6.1.2
Sampling Rate: 16kHz or 14.7kHz
6.3.7.2.6.1.3
Sampling Rate: 24kHz or 22.05kHz
6.3.7.2.6.1.4
Sampling Rate: 32kHz or 29.4kHz
6.3.7.2.6.1.5
Sampling Rate: 48kHz or 44.1kHz
6.3.7.2.6.1.6
Sampling Rate: 96kHz or 88.2kHz
6.3.7.2.6.1.7
Sampling Rate: 192kHz or 176.4kHz
6.3.7.2.6.2
Low-latency Filters
6.3.7.2.6.2.1
Sampling Rate: 24kHz or 22.05kHz
6.3.7.2.6.2.2
Sampling Rate: 32kHz or 29.4kHz
6.3.7.2.6.2.3
Sampling Rate: 48kHz or 44.1kHz
6.3.7.2.6.2.4
Sampling Rate: 96kHz or 88.2kHz
6.3.7.2.6.2.5
Sampling Rate: 192kHz or 176.4kHz
6.3.7.2.6.3
Ultra Low-latency Filters
6.3.7.2.6.3.1
Sampling Rate: 24kHz or 22.05kHz
6.3.7.2.6.3.2
Sampling Rate: 32kHz or 29.4kHz
6.3.7.2.6.3.3
Sampling Rate: 48kHz or 44.1kHz
6.3.7.2.6.3.4
Sampling Rate: 96kHz or 88.2kHz
6.3.7.2.6.3.5
Sampling Rate: 192kHz or 176.4kHz
6.3.7.2.7
Automatic Gain Controller (AGC)
6.3.7.2.8
Voice Activity Detection (VAD)
6.3.7.2.9
Ultrasonic Activity Detection (UAD)
6.3.8
Interrupts, Status, and Digital I/O Pin Multiplexing
6.3.9
Power Tune Mode
6.4
Device Functional Modes
6.4.1
Sleep Mode or Software Shutdown
6.4.2
Active Mode
6.4.3
Software Reset
6.5
Programming
6.5.1
Control Serial Interfaces
6.5.1.1
I2C Control Interface
6.5.1.1.1
General I2C Operation
6.5.1.1.2
I2C Single-Byte and Multiple-Byte Transfers
6.5.1.1.2.1
I2C Single-Byte Write
6.5.1.1.2.2
I2C Multiple-Byte Write
6.5.1.1.2.3
I2C Single-Byte Read
6.5.1.1.2.4
I2C Multiple-Byte Read
6.5.1.2
SPI Control Interface
7
Register Maps
7.1
Device Configuration Registers
7.1.1
TAD5212_B0_P0 Registers
7.1.2
TAD5212_B0_P1 Registers
7.1.3
TAD5212_B0_P3 Registers
7.2
Programmable Coefficient Registers
7.2.1
Programmable Coefficient Registers: Page 8
7.2.2
Programmable Coefficient Registers: Page 9
7.2.3
Programmable Coefficient Registers: Page 10
7.2.4
Programmable Coefficient Registers: Page 11
7.2.5
Programmable Coefficient Registers: Page 15
7.2.6
Programmable Coefficient Registers: Page 16
7.2.7
Programmable Coefficient Registers: Page 17
7.2.8
Programmable Coefficient Registers: Page 18
7.2.9
Programmable Coefficient Registers: Page 19
7.2.10
Programmable Coefficient Registers: Page 25
7.2.11
Programmable Coefficient Registers: Page 26
7.2.12
Programmable Coefficient Registers: Page 27
7.2.13
Programmable Coefficient Registers: Page 28
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Application
8.2.2
Design Requirements
8.2.3
Detailed Design Procedure
8.2.4
Application Performance Plots
8.2.5
Example Device Register Configuration Script for EVM Setup
8.3
Power Supply Recommendations
8.3.1
AVDD_MODE for 1.8V Operation
8.3.2
IOVDD_IO_MODE for 1.8V and 1.2V Operation
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGE|24
MPQF124G
Thermal pad, mechanical data (Package|Pins)
RGE|24
QFND808
Orderable Information
slasfc1a_oa
1
Features
Stereo differential or Quad single-ended high-performance audio DAC
Performance:
DAC to differential line-out dynamic range:
120
dB
DAC to differential headphone-out dynamic range:
118
dB
THD+N: –104 dB
Line-out/headphone output voltage:
Differential, 2V
RMS
full-scale
Psuedo-differential, 1V
RMS
full-scale
Single-ended, 1V
RMS
full-scale
DAC sample rates (f
s
) = 4kHz to 768kHz
Key features
Analog input to output bypass path
4-Channel PDM digital microphone record path
Input and output mix/mux options
Voice activity detection
Ultrasonic activity detection
Ultrasonic signal or tone generator
Battery and thermal foldback protection
Signal distortion limiter
Low and Ultra-low latency filter options
Programmable HPF and Biquad filters
I
2
C & SPI Control Interface
Audio Serial Interface
Format: TDM, I
2
S or Left-justified (LJ)
Word length: 16, 20, 24 or 32 Bits
Bus controller and target modes
Daisy chain in TDM Mode
Programmable PLL for flexible clocking
Auto clock and sample rate detection
Low Power Modes
11mW for 2-Ch Playback (1.8V supply)
Single Supply Operation AVDD: 1.8V or 3.3V
I/O Supply Operation: 1.2V or 1.8V or 3.3V
Temperature grade 1: -40°C ≤ T
A
≤ +125°C