SLASF31A December   2023  – October 2024 TAD5242

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: TDM, I2S or LJ Interface
    7. 5.7 Switching Characteristics: TDM, I2S or LJ Interface
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Hardware Control
      2. 6.3.2 Audio Serial Interfaces
        1. 6.3.2.1 Time Division Multiplexed Audio (TDM) Interface
        2. 6.3.2.2 Inter IC Sound (I2S) Interface
        3. 6.3.2.3 Left-Justified (LJ) Interface
      3. 6.3.3 Phase-Locked Loop (PLL) and Clock Generation
      4. 6.3.4 Analog Output Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 DAC Signal-Chain
        1. 6.3.6.1 Digital Interpolation Filters
          1. 6.3.6.1.1 Linear-phase filters
            1. 6.3.6.1.1.1 Sampling Rate: 8kHz or 7.35kHz
            2. 6.3.6.1.1.2 Sampling Rate: 16kHz or 14.7kHz
            3. 6.3.6.1.1.3 Sampling Rate: 24kHz or 22.05kHz
            4. 6.3.6.1.1.4 Sampling Rate: 32kHz or 29.4kHz
            5. 6.3.6.1.1.5 Sampling Rate: 48kHz or 44.1kHz
            6. 6.3.6.1.1.6 Sampling Rate: 96kHz or 88.2kHz
            7. 6.3.6.1.1.7 Sampling Rate: 192kHz or 176.4kHz
          2. 6.3.6.1.2 Low-latency Filters
            1. 6.3.6.1.2.1 Sampling Rate: 24kHz or 22.05kHz
            2. 6.3.6.1.2.2 Sampling Rate: 32kHz or 29.4kHz
            3. 6.3.6.1.2.3 Sampling Rate: 48kHz or 44.1kHz
            4. 6.3.6.1.2.4 Sampling Rate: 96kHz or 88.2kHz
            5. 6.3.6.1.2.5 Sampling Rate: 192kHz or 176.4kHz
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Performance Plots
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.1 Hardware Control

The device supports simple hardware-pin-controlled options to select a specific mode of operation and audio interface for a given system as summarized in Table 6-1. The MD1 to MD6 pins are connected to either logic low (VSS) or logic high (IOVDD), and the MD0 pin can be connected to AVDD or VSS through different pull-up or pull-down resistors.

Table 6-1 Pin Selectable Configurations Summary
PIN TARGET MODE CONTROLLER MODE
MD0 Multi-level analog input for controller/target mode and I2S/TDM/LJ mode selection
MD1 AVDD supply, word length, and interpolation filter type selection Frame rate and BCLK frequency selection
MD2
MD3 Ground Controller clock input
MD4 DAC output configuration selection (Differential Line-out/ Differential Receiver/Headphone/Single-ended Line-out/ Pseudo-differential Headphone)
MD5
MD6 TDM mode: Daisy chain output or I2S/LJ mode: Mono/Stereo selection