SLASEI9E july   2017  – july 2023 TAS2505-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  I2S/LJF/RJF Timing in Master Mode
    7. 6.7  I2S/LJF/RJF Timing in Slave Mode
    8. 6.8  DSP Timing in Master Mode
    9. 6.9  DSP Timing in Slave Mode
    10. 6.10 I2C Interface Timing
    11. 6.11 SPI Interface Timing
    12. 6.12 Typical Characteristics
      1. 6.12.1 Class D Speaker Driver Performance
      2. 6.12.2 HP Driver Performance
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Audio Analog I/O
      2. 8.3.2 Audio DAC and Audio Analog Outputs
      3. 8.3.3 DAC
      4. 8.3.4 POR
      5. 8.3.5 CLOCK Generation and PLL
      6. 8.3.6 Speaker Driver
      7. 8.3.7 Automotive Diagnostics
    4. 8.4 Device Functional Modes
      1. 8.4.1 Digital Pins
      2. 8.4.2 Analog Pins
      3. 8.4.3 Multifunction Pins
      4. 8.4.4 Analog Signals
        1. 8.4.4.1 Analog Inputs AINL and AINR
      5. 8.4.5 DAC Processing Blocks — Overview
      6. 8.4.6 Digital Mixing and Routing
      7. 8.4.7 Analog Audio Routing
      8. 8.4.8 5V LDO
      9. 8.4.9 Digital Audio and Control Interface
        1. 8.4.9.1 Digital Audio Interface
        2. 8.4.9.2 Control Interface
          1. 8.4.9.2.1 I2C Control Mode
          2. 8.4.9.2.2 SPI Digital Interface
        3. 8.4.9.3 Device Special Functions
    5. 8.5 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Circuit Configuration With Internal LDO
        1. 9.2.2.1 Design Requirements
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Pad
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
AVDD to AVSS–0.32.2V
DVDD to DVSS–0.32.2V
SPKVDD to SPKVSS–0.36V
IOVDD to IOVSS–0.33.9V
Digital input voltageIOVSS – 0.3IOVDD + 0.3V
Analog input voltageAVSS – 0.3AVDD + 0.3V
Operating temperature–40105°C
Junction temperature, TJ Max125°C
Power dissipation for VQFN package (with thermal pad soldered to board)(TJ Max – TA) / θJAW
Storage temperature, Tstg–55150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.