SLASEC2B November 2016 – February 2019 TAS2557
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
The TAS2557 monitors the die temperature and prevents it from going over a set limit. When enabled, an internal controller will automatically adjust the signal path gain to prevent the die temperature from exceeding this limit. This allows instantaneous peak power to be delivered to the speaker while limiting the continuous power to prevent thermal shutdown. The configuration parameters for the thermal fold-back are part of the DSP core and can be set using the PurePath Console 3 Software TAS2557 Application software for the TAS2557 part under the Device Control Tab.