SLASEE8B November 2016 – February 2019 TAS2559
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TAS2559 | UNIT | |
---|---|---|---|
YZ (DSBGA) | |||
42 PINS | |||
RθJA | Junction to Ambient Thermal Resistance | 49.8 | °C/W |
RθJC(top) | Junction to Case (top) Thermal Resistance | 0.2 | |
RθJB | Junction to Board Thermal Resistance | 7.1 | |
ψJT | Junction to Top Characterization Parameter | 0.8 | |
ψJB | Junction to Board Characterization Parameter | 7.1 | |
RθJC(bot) | Junction to Case (bottom) Thermal Resistance | n/a |