SLASE86E June   2016  – December 2017 TAS2560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  I2C Timing Requirements
    7. 7.7  I2S/LJF/RJF Timing in Master Mode
    8. 7.8  I2S/LJF/RJF Timing in Slave Mode
    9. 7.9  DSP Timing in Master Mode
    10. 7.10 DSP Timing in Slave Mode
    11. 7.11 PDM Timing
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  General I2C Operation
      2. 9.3.2  Single-Byte and Multiple-Byte Transfers
      3. 9.3.3  Single-Byte Write
      4. 9.3.4  Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 9.3.5  Single-Byte Read
      6. 9.3.6  Multiple-Byte Read
      7. 9.3.7  PLL
      8. 9.3.8  Clock Distribution
      9. 9.3.9  Clock Error Detection
      10. 9.3.10 Class-D Edge Rate Control
      11. 9.3.11 IV Sense
      12. 9.3.12 Boost Control
      13. 9.3.13 Thermal Fold-back
      14. 9.3.14 Battery Guard AGC
      15. 9.3.15 Configurable Boost Current Limit (ILIM)
      16. 9.3.16 Fault Protection
        1. 9.3.16.1 Speaker Over-Current
        2. 9.3.16.2 Analog Under-Voltage
        3. 9.3.16.3 Die Over-Temperature
        4. 9.3.16.4 Clocking Faults
        5. 9.3.16.5 Brownout
      17. 9.3.17 Spread Spectrum vs Synchronized
      18. 9.3.18 IRQs and Flags
      19. 9.3.19 CRC checksum for I2C
      20. 9.3.20 PurePath Console 3 Software TAS2560 Application
    4. 9.4 Device Functional Modes
      1. 9.4.1 Audio Digital I/O Interface
        1. 9.4.1.1 I2S Mode
        2. 9.4.1.2 DSP Mode
        3. 9.4.1.3 DSP Time Slot Mode
        4. 9.4.1.4 Right-Justified Mode (RJF)
        5. 9.4.1.5 Left-Justified Mode (LJF)
        6. 9.4.1.6 Mono PCM Mode
        7. 9.4.1.7 Stereo Application Example - TDM Mode
      2. 9.4.2 PDM MODE
    5. 9.5 Operational Modes
      1. 9.5.1 Hardware Shutdown
      2. 9.5.2 Software Shutdown
      3. 9.5.3 Low Power Sleep
      4. 9.5.4 Software Reset
      5. 9.5.5 Device Processing Modes
        1. 9.5.5.1 Mode 1 - PCM input playback only
        2. 9.5.5.2 Mode 2 - PCM input playback + PCM IVsense output
        3. 9.5.5.3 Mode 2 96k
        4. 9.5.5.4 Mode 3 - PCM input playback + PDM IVsense output
        5. 9.5.5.5 Mode 4 - PDM input playback only
        6. 9.5.5.6 Mode 5 - PDM input playback + PDM IVsense output
    6. 9.6 Programming
      1. 9.6.1 Device Power Up and Un-mute Sequence 8Ω load
      2. 9.6.2 Device Power Up and Un-mute Sequence 4Ω or 6Ω load
      3. 9.6.3 Mute and Device Power Down Sequence
    7. 9.7 Register Map
      1. 9.7.1  Register Map Summary
        1. 9.7.1.1 Register Summary Table
      2. 9.7.2  PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
      3. 9.7.3  RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
      4. 9.7.4  MODE (book=0x00 page=0x00 address=0x02) [reset=1h]
      5. 9.7.5  SPK_CTRL (book=0x00 page=0x00 address=0x04) [reset=5Fh]
      6. 9.7.6  PWR_CTRL_2 (book=0x00 page=0x00 address=0x05) [reset=0h]
      7. 9.7.7  PWR_CTRL_1 (book=0x00 page=0x00 address=0x07) [reset=0h]
      8. 9.7.8  RAMP_CTRL (book=0x00 page=0x00 address=0x08) [reset=1h]
      9. 9.7.9  EDGE_ISNS_BOOST (book=0x00 page=0x00 address=0x09) [reset=83h]
      10. 9.7.10 PLL_CLKIN (book=0x00 page=0x00 address=0x0F) [reset=41h]
      11. 9.7.11 PLL_JVAL (book=0x00 page=0x00 address=0x10) [reset=4h]
      12. 9.7.12 PLL_DVAL_1 (book=0x00 page=0x00 address=0x11) [reset=0h]
      13. 9.7.13 PLL_DVAL_2 (book=0x00 page=0x00 address=0x12) [reset=0h]
      14. 9.7.14 ASI_FORMAT (book=0x00 page=0x00 address=0x14) [reset=2h]
      15. 9.7.15 ASI_CHANNEL (book=0x00 page=0x00 address=0x15) [reset=0h]
      16. 9.7.16 ASI_OFFSET_1 (book=0x00 page=0x00 address=0x16) [reset=0h]
      17. 9.7.17 ASI_OFFSET_2 (book=0x00 page=0x00 address=0x17) [reset=0h]
      18. 9.7.18 ASI_CFG_1 (book=0x00 page=0x00 address=0x18) [reset=0h]
      19. 9.7.19 ASI_DIV_SRC (book=0x00 page=0x00 address=0x19) [reset=0h]
      20. 9.7.20 ASI_BDIV (book=0x00 page=0x00 address=0x1A) [reset=1h]
      21. 9.7.21 ASI_WDIV (book=0x00 page=0x00 address=0x1B) [reset=40h]
      22. 9.7.22 PDM_CFG (book=0x00 page=0x00 address=0x1C) [reset=0h]
      23. 9.7.23 PDM_DIV (book=0x00 page=0x00 address=0x1D) [reset=8h]
      24. 9.7.24 DSD_DIV (book=0x00 page=0x00 address=0x1E) [reset=8h]
      25. 9.7.25 CLK_ERR_1 (book=0x00 page=0x00 address=0x21) [reset=3h]
      26. 9.7.26 CLK_ERR_2 (book=0x00 page=0x00 address=0x22) [reset=3Fh]
      27. 9.7.27 IRQ_PIN_CFG (book=0x00 page=0x00 address=0x23) [reset=21h]
      28. 9.7.28 INT_CFG_1 (book=0x00 page=0x00 address=0x24) [reset=0h]
      29. 9.7.29 INT_CFG_2 (book=0x00 page=0x00 address=0x25) [reset=0h]
      30. 9.7.30 INT_DET_1 (book=0x00 page=0x00 address=0x26) [reset=0h]
      31. 9.7.31 INT_DET_2 (book=0x00 page=0x00 address=0x27) [reset=0h]
      32. 9.7.32 STATUS_POWER (book=0x00 page=0x00 address=0x2A) [reset=0h]
      33. 9.7.33 SAR_VBAT_MSB (book=0x00 page=0x00 address=0x2D) [reset=C0h]
      34. 9.7.34 SAR_VBAT_LSB (book=0x00 page=0x00 address=0x2E) [reset=0h]
      35. 9.7.35 DIE_TEMP_SENSOR (book=0x00 page=0x00 address=0x31) [reset=0h]
      36. 9.7.36 LOW_PWR_MODE (book=0x00 page=0x00 address=0x35) [reset=0h]
      37. 9.7.37 PCM_RATE (book=0x00 page=0x00 address=0x36) [reset=32h]
      38. 9.7.38 CLOCK_ERR_CFG_1 (book=0x00 page=0x00 address=0x4F) [reset=0h]
      39. 9.7.39 CLOCK_ERR_CFG_2 (book=0x00 page=0x00 address=0x50) [reset=11h]
      40. 9.7.40 PROTECTION_CFG_1 (book=0x00 page=0x00 address=0x58) [reset=3h]
      41. 9.7.41 CRC_CHECKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
      42. 9.7.42 BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Detailed Design Procedure
          1. 10.2.1.1.1 Mono/Stereo Configuration
          2. 10.2.1.1.2 Boost Converter Passive Devices
          3. 10.2.1.1.3 EMI Passive Devices
          4. 10.2.1.1.4 Miscellaneous Passive Devices
      2. 10.2.2 Application Performance Plots
    3. 10.3 Initialization Set Up
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
    2. 11.2 Power Supply Sequencing
      1. 11.2.1 Boost Supply Details
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

14.1 Package Dimensions

The TAS2560 uses a 30-ball, 0.4-mm pitch WCSP package.

TAS2560 YFF0030-C01_4222979_Page_01.gif
TAS2560 YFF0030-C01_4222979_Page_02.gif
TAS2560 YFF0030-C01_4222979_Page_03.gif