SLASE86E June   2016  – December 2017 TAS2560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  I2C Timing Requirements
    7. 7.7  I2S/LJF/RJF Timing in Master Mode
    8. 7.8  I2S/LJF/RJF Timing in Slave Mode
    9. 7.9  DSP Timing in Master Mode
    10. 7.10 DSP Timing in Slave Mode
    11. 7.11 PDM Timing
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  General I2C Operation
      2. 9.3.2  Single-Byte and Multiple-Byte Transfers
      3. 9.3.3  Single-Byte Write
      4. 9.3.4  Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 9.3.5  Single-Byte Read
      6. 9.3.6  Multiple-Byte Read
      7. 9.3.7  PLL
      8. 9.3.8  Clock Distribution
      9. 9.3.9  Clock Error Detection
      10. 9.3.10 Class-D Edge Rate Control
      11. 9.3.11 IV Sense
      12. 9.3.12 Boost Control
      13. 9.3.13 Thermal Fold-back
      14. 9.3.14 Battery Guard AGC
      15. 9.3.15 Configurable Boost Current Limit (ILIM)
      16. 9.3.16 Fault Protection
        1. 9.3.16.1 Speaker Over-Current
        2. 9.3.16.2 Analog Under-Voltage
        3. 9.3.16.3 Die Over-Temperature
        4. 9.3.16.4 Clocking Faults
        5. 9.3.16.5 Brownout
      17. 9.3.17 Spread Spectrum vs Synchronized
      18. 9.3.18 IRQs and Flags
      19. 9.3.19 CRC checksum for I2C
      20. 9.3.20 PurePath Console 3 Software TAS2560 Application
    4. 9.4 Device Functional Modes
      1. 9.4.1 Audio Digital I/O Interface
        1. 9.4.1.1 I2S Mode
        2. 9.4.1.2 DSP Mode
        3. 9.4.1.3 DSP Time Slot Mode
        4. 9.4.1.4 Right-Justified Mode (RJF)
        5. 9.4.1.5 Left-Justified Mode (LJF)
        6. 9.4.1.6 Mono PCM Mode
        7. 9.4.1.7 Stereo Application Example - TDM Mode
      2. 9.4.2 PDM MODE
    5. 9.5 Operational Modes
      1. 9.5.1 Hardware Shutdown
      2. 9.5.2 Software Shutdown
      3. 9.5.3 Low Power Sleep
      4. 9.5.4 Software Reset
      5. 9.5.5 Device Processing Modes
        1. 9.5.5.1 Mode 1 - PCM input playback only
        2. 9.5.5.2 Mode 2 - PCM input playback + PCM IVsense output
        3. 9.5.5.3 Mode 2 96k
        4. 9.5.5.4 Mode 3 - PCM input playback + PDM IVsense output
        5. 9.5.5.5 Mode 4 - PDM input playback only
        6. 9.5.5.6 Mode 5 - PDM input playback + PDM IVsense output
    6. 9.6 Programming
      1. 9.6.1 Device Power Up and Un-mute Sequence 8Ω load
      2. 9.6.2 Device Power Up and Un-mute Sequence 4Ω or 6Ω load
      3. 9.6.3 Mute and Device Power Down Sequence
    7. 9.7 Register Map
      1. 9.7.1  Register Map Summary
        1. 9.7.1.1 Register Summary Table
      2. 9.7.2  PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
      3. 9.7.3  RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
      4. 9.7.4  MODE (book=0x00 page=0x00 address=0x02) [reset=1h]
      5. 9.7.5  SPK_CTRL (book=0x00 page=0x00 address=0x04) [reset=5Fh]
      6. 9.7.6  PWR_CTRL_2 (book=0x00 page=0x00 address=0x05) [reset=0h]
      7. 9.7.7  PWR_CTRL_1 (book=0x00 page=0x00 address=0x07) [reset=0h]
      8. 9.7.8  RAMP_CTRL (book=0x00 page=0x00 address=0x08) [reset=1h]
      9. 9.7.9  EDGE_ISNS_BOOST (book=0x00 page=0x00 address=0x09) [reset=83h]
      10. 9.7.10 PLL_CLKIN (book=0x00 page=0x00 address=0x0F) [reset=41h]
      11. 9.7.11 PLL_JVAL (book=0x00 page=0x00 address=0x10) [reset=4h]
      12. 9.7.12 PLL_DVAL_1 (book=0x00 page=0x00 address=0x11) [reset=0h]
      13. 9.7.13 PLL_DVAL_2 (book=0x00 page=0x00 address=0x12) [reset=0h]
      14. 9.7.14 ASI_FORMAT (book=0x00 page=0x00 address=0x14) [reset=2h]
      15. 9.7.15 ASI_CHANNEL (book=0x00 page=0x00 address=0x15) [reset=0h]
      16. 9.7.16 ASI_OFFSET_1 (book=0x00 page=0x00 address=0x16) [reset=0h]
      17. 9.7.17 ASI_OFFSET_2 (book=0x00 page=0x00 address=0x17) [reset=0h]
      18. 9.7.18 ASI_CFG_1 (book=0x00 page=0x00 address=0x18) [reset=0h]
      19. 9.7.19 ASI_DIV_SRC (book=0x00 page=0x00 address=0x19) [reset=0h]
      20. 9.7.20 ASI_BDIV (book=0x00 page=0x00 address=0x1A) [reset=1h]
      21. 9.7.21 ASI_WDIV (book=0x00 page=0x00 address=0x1B) [reset=40h]
      22. 9.7.22 PDM_CFG (book=0x00 page=0x00 address=0x1C) [reset=0h]
      23. 9.7.23 PDM_DIV (book=0x00 page=0x00 address=0x1D) [reset=8h]
      24. 9.7.24 DSD_DIV (book=0x00 page=0x00 address=0x1E) [reset=8h]
      25. 9.7.25 CLK_ERR_1 (book=0x00 page=0x00 address=0x21) [reset=3h]
      26. 9.7.26 CLK_ERR_2 (book=0x00 page=0x00 address=0x22) [reset=3Fh]
      27. 9.7.27 IRQ_PIN_CFG (book=0x00 page=0x00 address=0x23) [reset=21h]
      28. 9.7.28 INT_CFG_1 (book=0x00 page=0x00 address=0x24) [reset=0h]
      29. 9.7.29 INT_CFG_2 (book=0x00 page=0x00 address=0x25) [reset=0h]
      30. 9.7.30 INT_DET_1 (book=0x00 page=0x00 address=0x26) [reset=0h]
      31. 9.7.31 INT_DET_2 (book=0x00 page=0x00 address=0x27) [reset=0h]
      32. 9.7.32 STATUS_POWER (book=0x00 page=0x00 address=0x2A) [reset=0h]
      33. 9.7.33 SAR_VBAT_MSB (book=0x00 page=0x00 address=0x2D) [reset=C0h]
      34. 9.7.34 SAR_VBAT_LSB (book=0x00 page=0x00 address=0x2E) [reset=0h]
      35. 9.7.35 DIE_TEMP_SENSOR (book=0x00 page=0x00 address=0x31) [reset=0h]
      36. 9.7.36 LOW_PWR_MODE (book=0x00 page=0x00 address=0x35) [reset=0h]
      37. 9.7.37 PCM_RATE (book=0x00 page=0x00 address=0x36) [reset=32h]
      38. 9.7.38 CLOCK_ERR_CFG_1 (book=0x00 page=0x00 address=0x4F) [reset=0h]
      39. 9.7.39 CLOCK_ERR_CFG_2 (book=0x00 page=0x00 address=0x50) [reset=11h]
      40. 9.7.40 PROTECTION_CFG_1 (book=0x00 page=0x00 address=0x58) [reset=3h]
      41. 9.7.41 CRC_CHECKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
      42. 9.7.42 BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Detailed Design Procedure
          1. 10.2.1.1.1 Mono/Stereo Configuration
          2. 10.2.1.1.2 Boost Converter Passive Devices
          3. 10.2.1.1.3 EMI Passive Devices
          4. 10.2.1.1.4 Miscellaneous Passive Devices
      2. 10.2.2 Application Performance Plots
    3. 10.3 Initialization Set Up
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
    2. 11.2 Power Supply Sequencing
      1. 11.2.1 Boost Supply Details
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Power Supply Recommendations

11.1 Power Supplies

The TAS2560 requires four power supplies:

  • Boost Input (terminal: VBAT)
    • Voltage: 2.9 V to 5.5 V
    • Max Current: 5 A for ILIM = 3.0 A (default)
  • Analog Supply (terminal: VDD)
    • Voltage: 1.65 V to 1.95 V
    • Max Current: 30 mA
  • Digital I/O Supply (terminal: IOVDD)
    • Voltage: 1.62 V to 3.6 V
    • Max Current: 5 mA

The decoupling capacitors for the power supplies should be placed close to the device terminals. For VBAT, IOVDD, and VDD, a small decoupling capacitor of 0.1 µF should be placed as close as possible to the device terminals. Refer to Figure 100 for the schematic.

11.2 Power Supply Sequencing

The following power sequence should be followed for power up and power down. If the recommended sequence is not followed there can be large current in device due to faults in level shifters and diodes becoming forward biased. The Tdelay between power supplies should be large enough for the power rails to settle.

TAS2560 power_sequencing.gif Figure 100. Power Supply Sequence for Power-Up and Power-Down

When the supplies have settled, the RESETZ terminal can be set HIGH to operate the device. Additionally the RESETZ pin can be tied to IOVDD and the internal DVDD POR will perform a reset of the device. After a hardware or software reset additional commands to the device should be delayed for 100uS to allow the OTP to load. The above sequence should be completed before any I2C operation.

11.2.1 Boost Supply Details

The boost supply (VBAT) and associated passives need to be able to support the current requirements of the device. By default, the peak current limit of the boost is set to 3 A. Refer to Configurable Boost Current Limit (ILIM) for information on changing the current limit. A minimum of a 10 µF capacitor is recommended on the boost supply to quickly support changes in required current. Refer to for the schematic.

The current requirements can also be reduced by lowering the gain of the amplifier, or in response to decreasing battery through the use of the battery-tracking AGC feature of the TAS2560 described in Battery Guard AGC.