SLASEI7A October 2018 – December 2018 TAS2562
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TAS2562 | UNIT | |
---|---|---|---|
YFF (WCSP) | |||
36 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 55.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 11.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |