SLOSE86B july 2022 – july 2023 TAS2781
PRODUCTION DATA
The TAS2781 monitors the die temperature and can automatically limit the audio signal when the die temperature reaches a set threshold. It is recommended to use the thermal fold-back registers to configure this protection mechanism as the internal DSP will perform the necessary calculation for each register.
Thermal fold-back can be disabled using TFB_EN bit . If the die temperature reaches the value set by TF_TMP_TH[31:0] bits of register from this feature will begin to attenuate the audio signal to prevent the device from shutting down due to over-temperature. It will attenuate the audio signal by a value set in TF_SLP[31:0] register bits over a range of temperature set by TF_TMP_TH[31:0] register bits. The thermal fold-back attack is set using the TF_ATK[31:0] register bits. A maximum attenuation can be specified using register bits TF_MAX_ATN[31:0]. However, if the device continue to heat up, eventually the device over-temperature will be triggered. The attenuation will be held for a number of samples set by register bits TF_HLD[31:0], before the attenuation will begin releasing.