SLASEG6 Data sheet

SLASEG6B May 2018 – June 2020 TAS3251

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

DKQ|56
- MPDS378A

Thermal pad, mechanical data (Package|Pins)

DKQ|56
- PPTD343

Orderable Information

slaseg6b_oa

7.1 Absolute Maximum Ratings

Free-air room temperature 25°C (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
Supply Voltage	PVDD_X to GND⁽²⁾	-0.3	50	V
	BST_X to GVDD_X⁽²⁾	-0.3	50	V
	BST_X to GND⁽²⁾	-0.3	62.5	V
	VDD to GND	-0.3	13.2	V
	GVDD_X to GND⁽²⁾	-0.3	13.2	V
	DVDD to GND	-0.3	4.2	V
	AVDD to GND	-0.3	8.5	V
	DAC_DVDD, DAC_AVDD	-0.3	3.9	V
Analog Interface Pins	SPK_OUTX to GND⁽²⁾	-0.3	50	V
Analog Interface Pins	SPK_INX to GND	-0.3	7	V
Digital Interface Pins	OC_ADJ, MODE, OSC_IOP, OSC_IOM, FREQ_ADJ, C_START to GND	-0.3	4.2	V
	RESET_AMP, FAULT, CLIP_OTW to GND	-0.3	4.2	V
	Continuous sink current RESET_AMP, FAULT, CLIP_OTW to GND		9	mA
	ADR, DAC_MUTE, LRCK, MCLK, SCL, SCLK, SDA, SDIN, SDOUT, XPU to GND	-0.5	V_{DAC_DVDD + 0.5}	V
T_J	Operating junction temperature range, power die	-40	165	°C
T_J	Operating junction temperature, digital die	-40	125	°C
T_stg	Storage temperature range	-40	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings only, and functional operation of the device at these or any other conditionsbeyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions forextended periods may affect device reliability.

(2) These voltages represents the DC voltage + peak AC waveformmeasured at the terminal of the device in all conditions..