SLES239A November   2008  – December 2016 TAS5352A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Audio Specifications (BTL)
    7. 6.7 Audio Specifications (Single-Ended Output)
    8. 6.8 Audio Specifications (PBTL)
    9. 6.9 Typical Characteristics
      1. 6.9.1 BTL Configuration
      2. 6.9.2 SE Configuration
      3. 6.9.3 PBTL Configuration
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Power-Up and Power-Down Sequence
        1. 7.3.1.1 Powering Up
        2. 7.3.1.2 Powering Down
      2. 7.3.2 Mid Z Sequence Compatibility
      3. 7.3.3 Error Reporting
      4. 7.3.4 Device Protection System
        1. 7.3.4.1 Use of TAS5352A in High-Modulation-Index Capable Systems
        2. 7.3.4.2 Overcurrent (OC) Protection With Current Limiting and Overload Detection
        3. 7.3.4.3 Pin-to-Pin Short-Circuit Protection (PPSC)
        4. 7.3.4.4 Overtemperature Protection
        5. 7.3.4.5 Undervoltage Protection (UVP) and Power-On-Reset (POR)
      5. 7.3.5 Device Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Protection MODE Selection Pins
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 BTL Application With AD Modulation Filters - 2N
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 PCB Material Recommendation
          2. 8.2.1.2.2 PVDD Capacitor Recommendation
          3. 8.2.1.2.3 Decoupling Capacitor Recommendations
        3. 8.2.1.3 Application Curves
      2. 8.2.2 BTL Application With AD Modulation Filters - 1N
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 SE Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curves
      4. 8.2.4 PBTL Application With AD Modulation Filters
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Application Curves
      5. 8.2.5 Non-Differential PBTL Application
        1. 8.2.5.1 Design Requirements
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.