SLOSE41C April   2020  – September 2023 TAS5441-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Audio Input and Preamplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Gate Drive
      4. 7.3.4 Power FETs
      5. 7.3.5 Load Diagnostics
        1. 7.3.5.1 Load Diagnostics Sequence
        2. 7.3.5.2 Faults During Load Diagnostics
      6. 7.3.6 Protection and Monitoring
      7. 7.3.7 I2C Serial Communication Bus
        1. 7.3.7.1 I2C Bus Protocol
        2. 7.3.7.2 Random Write
        3. 7.3.7.3 Random Read
        4. 7.3.7.4 Sequential Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Hardware Control Pins
      2. 7.4.2 EMI Considerations
      3. 7.4.3 Operating Modes and Faults
    5. 7.5 Register Maps
      1. 7.5.1 I2C Address Register Definitions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Amplifier Output Filtering
        2. 8.2.1.2 Amplifier Output Snubbers
        3. 8.2.1.3 Bootstrap Capacitors
        4. 8.2.1.4 Analog Audio Input Filter
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Unused Pin Connections
          1. 8.2.2.1.1 MUTE Pin
          2. 8.2.2.1.2 STANDBY Pin
          3. 8.2.2.1.3 I2C Pins (SDA and SCL)
          4. 8.2.2.1.4 Terminating Unused Outputs
          5. 8.2.2.1.5 Using a Single-Ended Audio Input
      3. 8.2.3 Application Curves
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Examples
      1. 9.2.1 Top Layer
      2. 9.2.2 Second Layer – Signal Layer
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2 Detailed Design Procedure

Use the following steps for the design procedure:

  • Step 1: Hardware Schematic Design: Using the Figure 8-1 as a guide, integrate the hardware into the system schematic.
  • Step 2: Following the layout guidelines recommended in Layout Guidelines, integrate the device and the supporting components into the system PCB file.
  • Step 3: Thermal Design: The device has an exposed thermal pad which requires proper soldering. For more information, see Semiconductor and IC Package Thermal Metrics and PowerPAD Thermally Enhanced Package.
  • Step 4: Develop software: The EVM User's Guide has detailed instructions for how to set up the device, interpret diagnostic information, and so forth. For information about control registers, see Section 7.5.

For questions and support, go to the E2E forums.