SLAS846A May   2012  – March 2015 TAS5614LA

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Audio Specification Stereo (BTL)
    7. 6.7 Audio Specification 4 Channels (SE)
    8. 6.8 Audio Specification Mono (PBTL)
    9. 6.9 Typical Characteristics
      1. 6.9.1 BTL Configuration
      2. 6.9.2 SE Configuration
      3. 6.9.3 PBTL Configuration
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1  Power Supplies
        1. 7.3.1.1 Boot Strap Supply
      2. 7.3.2  System Power-Up and Power-Down Sequence
        1. 7.3.2.1 Powering Up
        2. 7.3.2.2 Powering Down
      3. 7.3.3  Start-up and Shutdown Ramp Sequence
      4. 7.3.4  Unused Output Channels
      5. 7.3.5  Device Protection System
      6. 7.3.6  Pin-to-Pin Short-Circuit Protection (PPSC)
      7. 7.3.7  Overtemperature Protection
      8. 7.3.8  Overtemperature Warning, OTW
      9. 7.3.9  Undervoltage Protection (UVP) and Power-On Reset (POR)
      10. 7.3.10 Error Reporting
      11. 7.3.11 Fault Handling
      12. 7.3.12 Device Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Selection Pins
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 System Design Consideration
    2. 8.2 Typical Applications
      1. 8.2.1 Typical BTL Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical SE Configuration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Typical PBTL Configuration
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material Recommendation
      2. 10.1.2 PVDD Capacitor Recommendation
      3. 10.1.3 Decoupling Capacitor Recommendation
      4. 10.1.4 Circuit Component and Printed Circuit Board Recommendation
        1. 10.1.4.1 Circuit Component Requirements
        2. 10.1.4.2 Printed Circuit Board Requirements
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (May 2012) to A Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go