SLAS931 October   2017 TAS5634

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Audio Specification Stereo (BTL)
    6. 7.6 Audio Specifications Mono (PBTL)
    7. 7.7 Audio Specification 4 Channels (SE)
    8. 7.8 Electrical Characteristics
    9. 7.9 Typical Characteristics
      1. 7.9.1 BTL Configuration
      2. 7.9.2 PBTL Configuration
      3. 7.9.3 SE Configuration
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Closed-Loop Architecture
      2. 8.3.2  Power Supplies
        1. 8.3.2.1 BST, Bootstrap Supply
        2. 8.3.2.2 PVDD, Output Stage Power Supply
        3. 8.3.2.3 GVDD, Gate-Drive Power Supply
        4. 8.3.2.4 VDD Supply, Internal Regulators (DVDD and AVDD)
      3. 8.3.3  System Power-Up / Power-Down Sequence
        1. 8.3.3.1 Powering Up
        2. 8.3.3.2 Powering Down
      4. 8.3.4  Startup and Shutdown Ramp Sequence (C_START)
      5. 8.3.5  Device Protection System
      6. 8.3.6  Overload and Short Circuit Current Protection
      7. 8.3.7  DC Speaker Protection
      8. 8.3.8  Pin-To-Pin Short Circuit Protection (PPSC)
      9. 8.3.9  Overtemperature Protection
      10. 8.3.10 Overtemperature Warning, OTW
      11. 8.3.11 Undervoltage Protection (UVP) and Power-On Reset (POR)
      12. 8.3.12 Error Reporting
      13. 8.3.13 Fault Handling
      14. 8.3.14 System Design Consideration
    4. 8.4 Device Functional Modes
      1. 8.4.1 Stereo, Bridge-tied Load (BTL)
      2. 8.4.2 Mono, Paralleled Bridge-tied Load (PBTL)
      3. 8.4.3 4-Channel, Single-ended (SE)
      4. 8.4.4 BD Modulation
      5. 8.4.5 Device Reset
      6. 8.4.6 Unused Output Channels
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical BTL Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Pin Connections
        4. 9.2.1.4 Application Curves
      2. 9.2.2 Typical PBTL Configuration
        1. 9.2.2.1 Application Curves
      3. 9.2.3 Typical SE Configuration
        1. 9.2.3.1 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supplies
    2. 10.2 Bootstrap Supply
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material Recommendation
      2. 11.1.2 PVDD Capacitor Recommendation
      3. 11.1.3 Decoupling Capacitor Recommendation
      4. 11.1.4 Circuit Component Requirements
      5. 11.1.5 Printed Circuit Board Requirements
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

PowerPAD, PurePath, E2E are trademarks of Texas Instruments.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.