SLOS670B November   2010  – December 2016 TAS5727

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  DC Electrical Characteristics
    6. 8.6  AC Electrical Characteristics (BTL, PBTL)
    7. 8.7  PLL Input Parameters and External Filter Components
    8. 8.8  Serial Audio Ports Slave Mode
    9. 8.9  I2C Serial Control Port Operation
    10. 8.10 Reset Timing (RESET)
    11. 8.11 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagrams
    3. 10.3 Feature Description
      1. 10.3.1  Power Supply
      2. 10.3.2  I2C Address Selection and Fault Output
        1. 10.3.2.1 I2C Chip Select
        2. 10.3.2.2 I2C Device Address Change Procedure
        3. 10.3.2.3 Fault Indication
      3. 10.3.3  Device Protection Systems
        1. 10.3.3.1 Overcurrent (OC) Protection With Current Limiting
        2. 10.3.3.2 Overtemperature Protection
        3. 10.3.3.3 Undervoltage Protection (UVP) and Power-On Reset (POR)
      4. 10.3.4  Clock, Auto Detection, and PLL
      5. 10.3.5  PWM Section
      6. 10.3.6  SSTIMER Functionality
      7. 10.3.7  Single-Filter PBTL Mode
      8. 10.3.8  I2C Serial Control Interface
        1. 10.3.8.1 General I2C Operation
        2. 10.3.8.2 Single- and Multiple-Byte Transfers
        3. 10.3.8.3 Single-Byte Write
        4. 10.3.8.4 Multiple-Byte Write
        5. 10.3.8.5 Single-Byte Read
        6. 10.3.8.6 Multiple-Byte Read
      9. 10.3.9  Audio Serial Interface
      10. 10.3.10 Serial Interface Control and Timing
        1. 10.3.10.1 I2S Timing
        2. 10.3.10.2 Left-Justified
        3. 10.3.10.3 Right-Justified
      11. 10.3.11 Dynamic Range Control (DRC)
      12. 10.3.12 PWM Level Meter
    4. 10.4 Device Functional Modes
      1. 10.4.1 Stereo BTL Mode
      2. 10.4.2 Mono PBTL Mode
    5. 10.5 Programming
      1. 10.5.1 26-Bit 3.23 Number Format
    6. 10.6 Register Maps
      1. 10.6.1  Clock Control Register (0x00)
      2. 10.6.2  Device Id Register (0x01)
      3. 10.6.3  Error Status Register (0x02)
      4. 10.6.4  System Control Register 1 (0x03)
      5. 10.6.5  Serial Data Interface Register (0x04)
      6. 10.6.6  System Control Register 2 (0x05)
      7. 10.6.7  Soft Mute Register (0x06)
      8. 10.6.8  Volume Registers (0x07, 0x08, 0x09)
      9. 10.6.9  Volume Configuration Register (0x0E)
      10. 10.6.10 Modulation Limit Register (0x10)
      11. 10.6.11 Interchannel Delay Registers (0x11, 0x12, 0x13, and 0x14)
      12. 10.6.12 PWM Shutdown Group Register (0x19)
      13. 10.6.13 Start/Stop Period Register (0x1A)
      14. 10.6.14 Oscillator Trim Register (0x1B)
      15. 10.6.15 BKND_ERR Register (0x1C)
      16. 10.6.16 Input Multiplexer Register (0x20)
      17. 10.6.17 Channel 4 Source Select Register (0x21)
      18. 10.6.18 PWM Output MUX Register (0x25)
      19. 10.6.19 DRC Control Register (0x46)
      20. 10.6.20 PWM Switching Rate Control Register (0x4F)
      21. 10.6.21 Bank Switch and EQ Control (0x50)
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Stereo Stereo Bridge Tied Load Application
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Component Selection and Hardware Connections
          2. 11.2.1.2.2 I2C Pullup Resistors
          3. 11.2.1.2.3 Digital I/O Connectivity
          4. 11.2.1.2.4 Recommended Start-Up and Shutdown Procedures
            1. 11.2.1.2.4.1 Initialization Sequence
            2. 11.2.1.2.4.2 Normal Operation
            3. 11.2.1.2.4.3 Shutdown Sequence
            4. 11.2.1.2.4.4 Power-Down Sequence
        3. 11.2.1.3 Application Curves
      2. 11.2.2 Mono Parallel Bridge Tied Load Application
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
        3. 11.2.2.3 Application Curves
  12. 12Power Supply Recommendations
    1. 12.1 DVDD and AVDD Supplies
    2. 12.2 PVDD Power Supply
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Development Support
    2. 14.2 Documentation Support
      1. 14.2.1 Related Documentation
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Community Resources
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

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Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

15 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.